所有结果 (704)

散热片 Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm.

模块化计算机 - COM COM-HPC Size A module based on Intel Core i3-1220PE processor with 4 P-cores 1.5GHz up to 4.2GHz and 4 E-cores 1.1GHz up to 3.1GHz, 12MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code n

模块化计算机 - COM COM-HPC Size A module based on Intel Core i5-1250PE processor with 4 P-cores 1.7GHz up to 4.4GHz and 8 E-cores 1.2GHz up to 3.2GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 80EUs, Dual channel DDR5 4800 MT/s memory interfa

模块化计算机 - COM COM-HPC Size A module based on Intel Core i3-1215UE processor with 2 P-cores 1.2GHz up to 4.4GHz and 4 E-cores 0.9GHz up to 3.3GHz, 10MB Intel Smart Cache, Intel UHD Graphics with 64EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code n

CPU与芯片冷却器 Starterkit for SMARC 2.0 with SMARC module based on Intel Atom E3900 processor series. Includes congatec SMARC evaluation carrier board conga-SEVAL, SMARC module conga-SA5, cooling solution, adapters and cables.

散热片 Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

模块化计算机 - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.8GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.

CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.

散热片 Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i3-1215UE processor with 2 P-cores 1.2GHz up to 4.4GHz and 4 E-cores 0.9GHz up to 3.3GHz, 10MB Intel Smart Cache Intel UHD Graphics with 64EUs, Dual channel DDR5 4800 MT/s memory interface,

模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core i5-1245UE processor with 2 P-cores 2.5GHz up to 4.4GHz and 8 E-cores 1.1GHz up to 3.3GHz, 12MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 80 EUs, Dual channel DDR5 4800 MT/s m