+ 85 C 计算

结果: 960
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 产品类型 处理器类型 处理器品牌
Advantech 模块化计算机 - COM SMARC x6425E 16GLPDR4 -40-85CPhoenix

Computer-On-Modules - COM Atom x6425E Intel
Advantech 模块化计算机 - COM Ind i5-1145GREE 8GBDDR4 PCIe x4 Phoenix

Computer-On-Modules - COM Core i5-1145GRE Intel
Advantech 模块化计算机 - COM SMARC x7211RE 4GLPDDR5 32GEMMC 2LAN/CAN

Computer-On-Modules - COM Intel
Advantech 模块化计算机 - COM Atom x7211RE 6W 2C DDR5 eDP COMe Compact

Computer-On-Modules - COM Intel
Advantech 模块化计算机 - COM Atom x7433RE 12W 4C DDR5 COMe Compact

Computer-On-Modules - COM Intel
Advantech 模块化计算机 - COM Atom x7835RE 15W 8C DDR5 32G COMe Compac

Computer-On-Modules - COM Intel
Advantech 模块化计算机 - COM Intel i7-1365URE 32GLPDDR5 512GNVME COMe

Computer-On-Modules - COM Intel Core Intel
Ka-Ro electronics 模块化计算机 - COM QS8M/MQ/1600/1024S/4GF/E85 socketed module

Computer-On-Modules - COM i.MX 8M Mini NXP
Ka-Ro electronics 模块化计算机 - COM QS8M/ND/1400/512S/4GF/E85 socketed module

Computer-On-Modules - COM i.MX 8M Nano NXP
Ka-Ro electronics 模块化计算机 - COM QSMP/157C/512S/4GF/E85 socketed module

Computer-On-Modules - COM STM32MP1
Ka-Ro electronics 模块化计算机 - COM socketed version of QSMP-2350, needs additional QSBASE5 to run

Computer-On-Modules - COM ARM Cortex-A35, ARM Cortex-M33 ARM
Ka-Ro electronics 模块化计算机 - COM Socketed version of the QSRZ-G2L0 for use on the QSBASE4 QS-Evalkit.

Computer-On-Modules - COM RZ/G2L Renesas
ADLINK Technology 单板计算机 3U VPX CPU blade with Intel Xeon W-11865MRE, DDR4 32GB, XMC 2.0 slot, conformal coating & ETT, -40C to +85C, conduction-cooled
Single Board Computers Xeon W-11865MRE Intel
ADLINK Technology 单板计算机 3U VPX CPU blade with Intel Xeon W-11865MRE, DDR4 32GB, XMC 2.0 slot, conformal coating & ETT, -40C to +85C, conduction-cooled, with 1TB NVMe preinstalled
Single Board Computers Xeon W-11865MRE Intel
ADLINK Technology 模块化计算机 - COM COM Express Type7 module with Intel Ice Lake-D LCC D-1712TR, 4C, 3 SO-DIMMs

Computer-On-Modules - COM Xeon D-1712TR Xeon
ADLINK Technology 模块化计算机 - COM COM Express Type7 module with Intel Ice Lake-D LCC D-1715TER, 4C, 3 SO-DIMMs

Computer-On-Modules - COM Xeon D-1715TER Xeon
ADLINK Technology 模块化计算机 - COM COM Express Type7 module with Intel Ice Lake-D LCC D-1732TE, 8C, 3 SO-DIMMs

Computer-On-Modules - COM Xeon D-1732TE Intel
ADLINK Technology 模块化计算机 - COM COM Express Type7 module with Intel Ice Lake-D LCC D-1746TER, 10C, 3 SO-DIMMs

Computer-On-Modules - COM Xeon D-1746TER Xeon
ADLINK Technology 模块化计算机 - COM COM Express Type7 module with Intel Ice Lake-D LCC D-1746TER, 10C, 4 SO-DIMMs

Computer-On-Modules - COM Xeon D-1746TER Xeon
ADLINK Technology 模块化计算机 - COM SMARC 2.1 Quad Core NXP i.MX8M-Mini , 2 GB LPDDR4, 32 GB eMMC

Computer-On-Modules - COM i.MX 8M Mini NXP
ADLINK Technology 模块化计算机 - COM SMARC 2.1 with dual Core Intel Elkhart Lake x6211E, 8 GB LPDDR4, 128 GB eMMC

Computer-On-Modules - COM Atom X6211E Intel
ADLINK Technology 模块化计算机 - COM SMARC 2.1 dual Core Intel Elkhart Lake x6200FE, 4 GB LPDDR4, 64 GB eMMC

Computer-On-Modules - COM Atom X6200FE Intel
ADLINK Technology 模块化计算机 - COM SMARC 2.1 quad Core Intel Elkhart Lake x6414RE, 2 GB LPDDR4, 32 GB eMMC

Computer-On-Modules - COM Atom X6414RE Intel
ADLINK Technology 模块化计算机 - COM SMARC 2.1 quad Core Intel Elkhart Lake x6425RE, 4 GB LPDDR4, 64 GB eMMC

Computer-On-Modules - COM Atom X6425RE Intel
ADLINK Technology 模块化计算机 - COM SMARC 2.1 dual Core Intel Elkhart Lake x6211E, 2 GB LPDDR4, 32 GB eMMC

Computer-On-Modules - COM Atom X6211E Intel