2.7 V 多协议模块

结果: 28
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - WiFi - 802.11 封装
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 815库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Crowd Supply 多协议模块 SuperB (built-in trace) by Macchina 37库存量
最低: 1
倍数: 1
2.4 GHz 18.5 dBm GPIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C Built-In 26.2 mm x 25.5 mm x 7.8 mm Bluetooth 802.11 b/g/n
Crowd Supply 多协议模块 SuperBx (U.FL for external antenna) by Macchina 39库存量
最低: 1
倍数: 1
2.4 GHz 18.5 dBm GPIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C u.FL 26.2 mm x 25.5 mm x 7.8 mm Bluetooth 802.11 b/g/n
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 65库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Microchip Technology 多协议模块 SMARTCONNECT WINC3400 WL MOD 780库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 130库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4, IPEX antenna connector, -40C - +105C 5,119库存量
最低: 1
倍数: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C External 13.2 mm x 12.5 mm x 2.4 mm Bluetooth Tray
Microchip Technology 多协议模块 b/g/n + Bluetooth 4 Module U.FL Antenna 46库存量
最低: 1
倍数: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R 160库存量
最低: 1
倍数: 1
: 500

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna 61库存量
最低: 1
倍数: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Espressif Systems 多协议模块 SMD module, ESP32-C3FH4, PCB antenna, -40C - +105C 887库存量
最低: 1
倍数: 1
: 650

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R 25库存量
最低: 1
倍数: 1
: 500

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape


Espressif Systems 多协议模块 Espressifs AWS IoT ExpressLink Module, pre-provisioned with required certificates and the ExpressLink firmware, for out-of-the-box connectivity to AWS IoT Core. 465库存量
1,300预期 2026/7/27
最低: 1
倍数: 1
2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth Bulk
Microchip Technology 多协议模块 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 22库存量
最低: 1
倍数: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Seeed Studio 多协议模块 EMC3080 WI-FI&BLE Module - Support MXMESH 5库存量
最低: 1
倍数: 1
2.4 GHz I2C, SPI 2.7 V 3.3 V - 40 C + 105 C IPEX, PCB 2.4 cm x 2.6 cm x 0.3 cm Bluetooth 5.0 802.11 b/g/n
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module,u.FL Antenna 26库存量
最低: 1
倍数: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna
500在途量
最低: 1
倍数: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Murata Electronics 多协议模块 Type 1XK Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2
972预期 2026/12/24
最低: 1
倍数: 1
: 500

1XK 2.4 GHz, 5 GHz UART 2.7 V 5.5 V - 40 C + 85 C u.FL 9.1 mm x 8.3 mm x 1.3 mm Bluetooth 5.2 Reel, Cut Tape
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna 交货期 8 周
最低: 1
倍数: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Kaga FEI 多协议模块 WiFi 11ac/a/b/g/n, Bluetooth V4.2. (NXP 8887), Size 24.0 x 11.5 x2.0mm module with antenna 无库存
最低: 960
倍数: 960
: 960
2.4 GHz, 5 GHz 2.7 V 3.6 V - 35 C + 85 C 24 mm x 11.5 mm x 2 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
DFRobot 多协议模块 ESP32 WIFI+BLE Module (IPEX antenna) 无库存
最低: 1
倍数: 1
2.5 GHz 20 dBm GPIO, I2C,I2S, PWM, SDIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C IPEX 31.4 mm x 18 mm x 3.3 mm BLE, Bluetooth 802.11 b/g/n
DFRobot 多协议模块 ESP32 WIFI+BLE Module (PCB antenna) 无库存
最低: 1
倍数: 1

2.4 GHz 20 dBm GPIO, I2C, I2S, PWM, SDIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C PCB 31.4 mm x 18 mm x 3.3 mm Bluetooth 802.11 b/g/n

Espressif Systems 多协议模块 SMD Module, ESP32-D0WD, 64Mbits PSRAM, 64Mbits SPI flash, PCB Antenna 无库存
最低: 650
倍数: 650

ESP32-WROVER 2.4 GHz to 2.5 GHz 18.5 dBm ADC, DAC, GPIO, I2C, I2S, PWM, SD Card, SDIO, SPI, TWAI, UART 2.7 V 3.6 V - 40 C + 65 C 18 mm x 31.4 mm x 3.3 mm Bluetooth 802.11 b/g/n

Espressif Systems 多协议模块 SMD Module, ESP32-D0WD, 64Mbits PSRAM, 32Mbits SPI flash, PCB Antenna 无库存
最低: 650
倍数: 650

ESP32-WROVER 2.4 GHz to 2.5 GHz 18.5 dBm ADC, DAC, GPIO, I2C, I2S, PWM, SD Card, SDIO, SPI, TWAI, UART 2.7 V 3.6 V - 40 C + 65 C 18 mm x 31.4 mm x 3.3 mm Bluetooth 802.11 b/g/n
Microchip Technology 多协议模块 Wi-Fi + Bluetooth LE Module, Chip Antenna

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray