ATS-1041-C2-R0

Advanced Thermal Solutions
984-ATS-1041-C2-R0
ATS-1041-C2-R0

制造商：

说明：
散热片 maxiFLOW BGA Heat Sink+Brass pushPIN, Performance, Cross-Cut, Green, 41x45x10mm

数据表:
ECAD模型:
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产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Heat Sinks
BGA
Bracket
Aluminum
5 C/W
41 mm
45 mm
10 mm
商标: Advanced Thermal Solutions
颜色: Green
封装: Bulk
产品类型: Heat Sinks
系列: maxiFLOW XCut PushPIN
工厂包装数量: 100
子类别: Heat Sinks
商标名: maxiFLOW pushPIN
类型: Component
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已选择的属性: 0

数据表

Test/Quality Data

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合规代码
CNHTS:
3926909090
CAHTS:
3926909990
USHTS:
7616995190
JPHTS:
392690029
TARIC:
3926909790
ECCN:
EAR99
原产地分类
原产国:
中国
组装原产国/地区:
不可用
扩散国家:
不可用
发货时，国家/地区可能会发生变化。

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

maxiFLOW™ Cross-Cut Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Cross-Cut Heat Sinks feature a spread-fin array to maximize surface-area cooling and deliver excellent thermal performance. Effective convection cooling from the spread-fin arrays enables a 20% lower junction temperature and a 40% reduction in thermal resistance compared to straight-fin and pin-fin sinks. Whenever higher cooling capacity is required, maxiFLOW heat sinks with thermal tape can be used, and the double-sided adhesive thermal tape enables the attachment of the heat sink to the device. Advanced Thermal Solutions maxiFLOW Cross-Cut Heat Sinks meet the thermal requirements of various electronics packages, including BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, and LQFP.

供货情况

库存：
0

您可以延期订购此产品。

在途量:
90
预期 2026/9/11
生产周期：
8
周 大于所示数量的预计工厂生产时间。
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥155.262 ¥155.26
¥138.7979 ¥1,387.98
¥132.1761 ¥2,643.52
¥121.3394 ¥6,066.97
¥117.8703 ¥11,787.03
¥113.0678 ¥22,613.56
¥111.0903 ¥55,545.15
1,000 报价

出现意外错误。


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