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ATS043045016-PF033

Name: Advanced Thermal Solutions ATS043045016-PF033
Brand: Advanced Thermal Solutions
SKU: 984-AT043045016PF033
Price: 46.99 RMB
Availability: InStock

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Mouser编号：

984-AT043045016PF033

制造商编号：

ATS043045016-PF033

制造商：

Advanced Thermal Solutions

说明：

散热片 BGA Heat Sink, Pin Fin, No TIM, Black Anodized, 44.5x43.2x16.5mm (LxWxH)

数据表:

ATS043045016-PF033 数据表 (PDF)

ECAD模型:

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库存量: 75

库存：: 75 可立即发货

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生产周期：: 13 周大于所示数量的预计工厂生产时间。

输入数量：

最少： 1 倍数： 1

单价:

¥-.--

总价:

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预估关税:

定价 (含13% 增值税)

数量	单价	总价
	¥53.0987	¥53.10
	¥47.0645	¥470.65
	¥44.8271	¥896.54
	¥43.1773	¥2,158.87
	¥41.5275	¥4,152.75
	¥39.1206	¥7,824.12
	¥38.1375	¥19,068.75
	¥36.725	¥36,725.00

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产品属性	属性值	选择属性
制造商:	Advanced Thermal Solutions
产品种类:	散热片
RoHS:
产品:	Heat Sinks
设计目的:	BGA
安装风格:	PCB
散热片材料:	Aluminum
散热片样式:	Omnidirectional Fin
热阻:	3.2 C/W
长度:	44.5 mm
宽度:	43.2 mm
高度:	16.5 mm
商标:	Advanced Thermal Solutions
颜色:	Black
封装:	Bulk
产品类型:	Heat Sinks
系列:	BGA High Aspect Ratio
工厂包装数量:	100
子类别:	Heat Sinks
商标名:	Value-Line Platform
类型:	Component

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已选择的属性: 0

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数据表

ATS043045016-PF033 数据表 (PDF)

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CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.