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SPA2000-0.020-00-1012

Name: Bergquist Company SPA2000-0.020-00-1012
Brand: Bergquist Company
SKU: 951-A2000-020-001012
Price: 2177.13 RMB
Availability: OutOfStock

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Mouser编号：

951-A2000-020-001012

制造商编号：

SPA2000-0.020-00-1012

制造商：

Bergquist Company

说明：

导热接口产品 Insulator, 10"x12" Sheet, 0.020" Thickness, Sil-Pad TSPA3000/A2000, IDH 2189298

数据表:

SPA2000-0.020-00-1012 数据表 (PDF)

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产品属性	属性值	选择属性
制造商:	Bergquist Company
产品种类:	导热接口产品
RoHS:
产品:	Thermally Conductive Insulators
类型:	Thermal Pad
封装 / 箱体:	Non-standard
材料:	Silicone Elastomer
导热性:	3 W/m-K
击穿电压:	4 kVAC
颜色:	White
最小工作温度:	- 60 C
最大工作温度:	+ 200 C
厚度:	0.508 mm
抗拉强度:	50 psi
可燃性等级:	UL 94 V-0
系列:	A2000 / TSP A3000
商标:	Bergquist Company
产品类型:	Thermal Interface Products
工厂包装数量:	1
子类别:	Thermal Management
商标名:	Sil-Pad
零件号别名:	L12INW10INH0.02 BG410632 L12INW10INH0D0 2189298
单位重量:	174.255 g

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RoHS Certificate (PDF)

合规代码

CNHTS:: 8541900000
USHTS:: 8541900080
ECCN:: EAR99

原产地分类

原产国:: 美国
组装原产国/地区:: 不可用
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

TSP A3000 High Performance SIL PAD®

Bergquist Company TSP A3000 High-Performance SIL PAD^® are conformable elastomers with ultra-high 3W/m.K thermal conductivity that acts as a thermal interface between electrical components and heat sinks. These inductors are designed for applications where optimal heat transfer is required. These thermally conductive silicone elastomers offer a thermal impedance of 0.32°C-in²/W (at 50psi). They are formulated to maximize the thermal and dielectric performance of the filler/binder matrix. This results in a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications. Bergquist Company SIL PAD TSP A3000 High-Reliability Insulators are ideal for use in motor drive controls, avionics applications, high-voltage power supplies, and power transistor/heat sink interfaces.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD^® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.