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14L-608-210-AA2

Name: EDAC 14L-608-210-AA2
Brand: EDAC
SKU: 587-14L-608-210-AA2
Price: 2.71 RMB
Availability: InStock

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Mouser编号：

587-14L-608-210-AA2

制造商编号：

14L-608-210-AA2

制造商：

EDAC

说明：

集管和线壳 14L Series (.156"(3.96mm) contact spacing) Inline 8 positions socket housing only

数据表:

14L-608-210-AA2 数据表 (PDF)

ECAD模型:

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产品属性	属性值	选择属性
制造商:	EDAC
产品种类:	集管和线壳
RoHS:
产品:	Wire Housings
类型:	Socket
位置数量:	8 Position
节距:	3.96 mm (0.156 in)
排数:	1 Row
安装风格:	Cable Mount / Free Hanging
端接类型:	Crimp
安装角:	Straight
触点电镀:	Gold
系列:	14L
应用:	Wire-to-Board
线规:	22 AWG to 18 AWG
最小工作温度:	- 25 C
最大工作温度:	+ 105 C
封装:	Bulk
商标:	EDAC
触点材料:	Phosphor Bronze
电流额定值:	7 A
可燃性等级:	UL 94 V-0
外壳颜色:	Natural
胶壳接口类型:	Female
外壳材料:	Nylon
绝缘电阻:	1 GOhms
产品类型:	Headers & Wire Housings
工厂包装数量:	1000
子类别:	Headers & Wire Housings
电压额定值:	250 VAC/DC

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已选择的属性: 0

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数据表

14L-608-210-AA2 数据表 (PDF)

Test/Quality Data

Nylon Housing Insulator Declaration (PDF)

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合规代码

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

原产地分类

原产国:: 中国
组装原产国/地区:: 不可用
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

14L Series 3.96mm Inline Wire-to-Board Connectors

EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors feature a 3.96mm pitch, 7A current rating, and an operating temperature range of -25°C to +105°C. The insulator material has a UL 94V-0 flammability rating and top- or side-entry configurations. 14L series connectors accept 22AWG to 18AWG wires and offer a 1500V_AC dielectric withstanding voltage, 1000MΩ insulation resistance, and 10mΩ maximum contact resistance. EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors are for use with PCB boards of 1.6mm nominal thicknesses.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.