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IT3D-200S-BGA(39)

图像仅供参考
请参阅产品规格

Mouser编号：

798-IT3D200SBGA39

制造商编号：

IT3D-200S-BGA(39)

制造商：

Hirose Connector

说明：

板对板与夹层连接器

数据表:

IT3D-200S-BGA(39) 数据表 (PDF)

ECAD模型:

下载免费库加载程序，将此文件转换，以供您的ECAD工具使用。了解详情。

更多信息

了解Hirose Connector IT3D-200S-BGA(39)详情

发货提醒：

Mouser 目前在您所在地区不销售该产品。

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产品属性	属性值	选择属性
制造商:	Hirose Electric
产品种类:	板对板与夹层连接器
发货限制：	Mouser 目前在您所在地区不销售该产品。
RoHS:
产品:	Receptacles
位置数量:	200 Position
节距:	1.5 mm (0.059 in)
端接类型:	Solder Balls
安装角:	Straight
叠放高度:	39 mm
电流额定值:	1 A
电压额定值:	50 V
最大数据速率:	10 Gbps
最小工作温度:	- 55 C
最大工作温度:	+ 85 C
触点电镀:	Gold
触点材料:	Copper Alloy
外壳材料:	Liquid Crystal Polymer (LCP)
系列:	IT3
封装:	Tray
商标:	Hirose Connector
产品类型:	Board to Board & Mezzanine Connectors
工厂包装数量:	24
子类别:	Board to Board & Mezzanine Connectors
零件号别名:	636-0003-8-39

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已选择的属性: 0

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数据表

IT3D-200S-BGA(39) 数据表 (PDF)

PCN

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合规代码

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

原产地分类

原产国:: 马来西亚
组装原产国/地区:: 不可用
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

Medical Solutions

Hirose Electric Medical Solutions include high-performance connectors engineered for precision, durability, and reliability in demanding applications. Products offered include board-to-board, wire-to-board, FPC/FFC, circular, and coaxial connectors with IP67/IP68 sealing to protect against debris, dust, and moisture ingress. Features include EMI shielding, extended mating cycles, and secure locking, ensuring stable interference-free performance. The miniaturized products from Hirose support compact, high-density systems, while hybrid signal/power designs and RoHS/IEC compliance meet the evolving needs of diagnostic imaging, patient monitoring, therapy systems, and wearable medical tech.

IT3 High-Speed BGA Mezz Connectors

Hirose IT3 High-Speed BGA Mezz Connectors transmit differential, single-ended, and power through one package. The stackable IT3 series (ranging from 15mm to 40mm) provides reliable connections for today's data rates, including PCIe and XAUI, as well as 10+ Gbps systems. Hirose IT3 High-Speed BGA Mezz Connectors offer a staggered 1.5mm x 1.75mm ball grid array. Additional features include 100, 200, and 300 contacts (+90% additional grounds), low mating/extracting forces, wide misalignment tolerances for multiple connector use, and excellent reflow solderability. The IT3 system features three basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB, and different height interposer assemblies are selected to achieve the needed height between the PCBs.