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Open Mode FO-CAP MLCCs

KEMET Open Mode Design (FO-CAP) MLCCs in X7R dielectric were designed to significantly minimize the potential of low IR or short circuit when the capacitor is forced to failure in a board stress flex situation. The Open Mode capacitor may experience capacitance loss with no chance of a short because a flex crack will not typically propagate across counter electrodes within the device's "active area." The lack of current leakage from the Open Mode flex crack eliminates localized heating, therefore, greatly reducing the risk of a catastrophic and costly failure event. Open Mode designed devices compliment KEMET Floating Electrode (FE-CAP) and Floating Electrode with Flexible Termination (FF-CAP) products by providing a fail-safe design optimized for mid to high-range capacitance values.

KEMET X8L Series High-Temperature Capacitors - EXPANSION

KEMET has expanded the X8L series 150ºC high-temperature capacitors to include the new flexible termination option on all EIA case sizes except 0402. Flexible Termination technology directs board flex stress away from the ceramic body and into the termination area, resulting in lower risk of flex cracks that can lead to low IR or short circuit failures.

The KEMET X8L and Ultra Stable X8R 150C Dielectrics are high temperature ceramic surface mount capacitors that are ideal in harsh environments such as Down Hole (oil exploration), automotive (under hood), and aerospace. The KEMET X8L 150°C Dielectric operates from -55°C to +150°C with capacitance shift limited to ±15% from -55°C to 125°C and +15, -40% from 125°C to 150°C. The KEMET X8L is available in case sizes EIA 0402, 0603, 0805, 1206, and 1210. The KEMET Ultra Stable X8R 150°C Dielectric exhibits no capacitance loss when DC voltage is applied and is available in case sizes EIA 0402, 0603, 0805, 1206, 1210, and 1812.
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柔性表面贴装≤250V MLCC

KEMET柔性缓解表面贴装 ≤250V MLCC是设计用于降低柔性裂纹风险的解决方案。这些解决方案包括以下内容：柔性端接 (FT-CAP)、浮动电极 (FE-CAP) 和开放模式 (FO-CAP) 技术。 

高CV多层陶瓷电容器 (MLCC)

KEMET高CV多层陶瓷电容器 (MLCC) 是优选电容解决方案，可为电路设计人员提供出色的性能、可靠性和成本优势。陶瓷是非极性器件，可提供无与伦比的容积效率，以小封装尺寸提供高电容。KEMET高CV MLCC有多种尺寸可供选择，具有非常低的等效串联电阻 (ESR)，具有优异的高频特性，并且非常可靠。MLCC是由特殊配方的陶瓷介电材料层与金属电极系统交错叠压形成的单片器件，经过高温烧结，成为高容积效率的电容器件。该器件的裸露端集成一个导电性端接隔离系统，从而完成连接。

X7R汽车和商用开放模式电容器

KEMET X7R汽车和商用开放模式电容器具有16V_DC 至200V_DC 电压范围、1000pF至6.8µF电容以及±5%、±10%或±20%电容容差。这些电容器采用柔性端接技术，可防止将电路板应力传递到刚性陶瓷体。与标准终端系统相比，该技术具有出色的弯曲性能，可提供出色的低IR或短路保护。KEMET X7R汽车和商用开放模式电容器的工作温度范围为-55°C至+125°C。