QTE-014-10-F-D-DP

Samtec
200-QTE01410FDDP
QTE-014-10-F-D-DP

制造商：

说明：
板对板与夹层连接器 Q Strip High-Speed Ground Plane Header

数据表:
ECAD模型:
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产品属性 属性值 选择属性
Samtec
产品种类: 板对板与夹层连接器
发货限制：
 Mouser 目前在您所在地区不销售该产品。
RoHS:  
Headers
28 Position
0.8 mm (0.031 in)
2 Row
Solder
Straight
15 mm
2 A
225 VAC
- 55 C
+ 125 C
Gold
Phosphor Bronze
Liquid Crystal Polymer (LCP)
QTE
Tray
应用: Power, Signal
商标: Samtec
可燃性等级: UL 94 V-0
安装风格: SMD/SMT
产品类型: Board to Board & Mezzanine Connectors
工厂包装数量: 40
子类别: Board to Board & Mezzanine Connectors
商标名: Q Strip
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已选择的属性: 0

数据表

Technical Resources

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Q Strip™ High-Speed Mezzanine Connectors

Samtec Q Strip™ High-Speed Mezzanine Connectors are designed for high-speed board-to-board applications where signal integrity is essential. Q Strip connectors have surface-mount signal contacts and a surface-mount ground plane between the two rows of signals for improved electrical performance. Mated sets of Samtec Q Strip connectors are available in 8 different stack heights from 5mm (.197") to 30mm (1.180"). Options include guideposts for blind mate scenarios and alignment pins and locking clips for proper connector placement before reflow.

5G解决方案

Samtec 5G解决方案支持新兴5G技术所需的超高频率和高数据速率。随着5G网络的快速发展，mmWave、大规模MIMO、波束成形和全双工 (FDX) 等技术需要新的系统、器件和设备。采用Samtec 5G解决方案的高性能产品面向四种应用，即：测试和开发系统、远程无线电和有源天线、网络设备以及汽车和运输。

灵活堆叠电路板连接器

Samtec灵活堆叠电路板连接器提供大量具有出色设计灵活性的板对板连接器。这些板对板连接器系统提供各种间距、密度、堆叠高度、组装方向和其他标准或修改选项，从中可以轻松找到适合各种应用的连接器。灵活堆叠选项包括单片、薄型通孔、加高、公母同一、遮蔽、共面、平行、垂直。接线柱高度能够以0.005” (0.13mm) 的增量进行调节。

Q Strip™ QTE High-Speed Ground Plane Headers

Samtec Q Strip™ QTE High-Speed Ground Plane Headers are an Extended Life Product (E.L.P.™) and offer 5mm to 30mm stack heights and up to 200 positions. The QTE series features a 225VAC voltage rating, a 2A per pin current rating, and a 28+Gbps solution. These headers have an integral metal plane that is useful for power or ground. Samtec Q Strip™ QTE High-Speed Ground Plane Headers are compatible with UMPT/UMPS for flexible two-piece power/signal solutions.

5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

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