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2007637-6

Name: TE Connectivity 2007637-6
Brand: TE Connectivity
SKU: 571-2007637-6
Price: 342.72 RMB
Availability: InStock

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Mouser编号：

571-2007637-6

制造商编号：

2007637-6

制造商：

TE Connectivity

说明：

I/O 连接器 SFP+assy 2x2 Spring Fingers Inner LP Sn

数据表:

2007637-6 数据表 (PDF)

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产品属性	属性值	选择属性
制造商:	TE Connectivity
产品种类:	I/O 连接器
RoHS:
产品:	Cage Assemblies
位置数量:	80 Position
节距:	0.8 mm
触点电镀:	Gold
安装风格:	Through Hole
端接类型:	Press Fit
安装角:	Right Angle
系列:	SFP+
最小工作温度:	- 55 C
最大工作温度:	+ 105 C
商标:	TE Connectivity
产品类型:	I/O Connectors
工厂包装数量:	20
子类别:	I/O Connectors
单位重量:	59.363 g

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已选择的属性: 0

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数据表

2007637-6 数据表 (PDF)

Images

RoHS Certificate (PDF)

合规代码

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

原产地分类

原产国:: 中国
组装原产国/地区:: 不可用
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.