8810-4X10

Name: 3M 8810-4X10
Brand: 3M Electronic Specialty
SKU: 517-8810-4X10
Price: 1196.97 RMB
Availability: InStock

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Mouser编号：

517-8810-4X10

制造商编号：

8810-4X10

制造商：

3M Electronic Specialty

说明：

导热接口产品 Thermally Conductive Adhesive Transfer, Acrylic, White, 9.14 m

数据表:

8810-4X10 数据表 (PDF)

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产品属性	属性值	选择属性
制造商:	3M
产品种类:	导热接口产品
RoHS:
产品:	Thermally Conductive Adhesive Tape
类型:	Thermally Conductive Tape
封装 / 箱体:	Non-standard
材料:	Acrylic
导热性:	0.60 W/m-K
颜色:	White
最大工作温度:	+ 70 C
长度:	9.14 m
宽度:	101.6 mm
厚度:	0.25 mm
可燃性等级:	UL 74 6-C
系列:	8810
商标:	3M Electronic Specialty
产品类型:	Thermal Interface Products
工厂包装数量:	6
子类别:	Thermal Management
零件号别名:	7000050172
单位重量:	2.017 kg

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数据表

8810-4X10 数据表 (PDF)

合规代码

USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

原产地分类

原产国:: 韩国
组装原产国/地区:: 韩国
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.

导热界面垫片

3M™导热界面垫片设计用于在发热元件、散热器和其他冷却设备之间提供优化的热传递路径。界面垫片由高度兼容且略带粘性的硅胶弹性体和导热陶瓷颗粒制成，有助于增强导热性并提供出色的绝缘性能。典型应用包括集成电路 (IC) 芯片封装热传导、散热片接触面、LED板热接口材料 (TIM)、覆晶薄膜 (COF) 热传导。