ATS-59001-C1-R0

Advanced Thermal Solutions
984-ATS-59001-C1-R0
ATS-59001-C1-R0

制造商：

说明：
散热片 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 21mm Comp, 28x45x11mm

数据表:
ECAD模型:
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供货情况

库存：
100 可于 20 天后发货
最少： 100   倍数： 100
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥262.6233 ¥26,262.33
¥256.0015 ¥51,200.30
500 报价

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
maxiFLOW
4.5 C/W
45 mm
21 mm
11 mm
商标: Advanced Thermal Solutions
颜色: Black
封装: Bulk
产品类型: Heat Sinks
系列: maxiGRIP HS ASM - Custom
工厂包装数量: 100
子类别: Heat Sinks
商标名: maxiFLOW maxiGRIP
类型: Component
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已选择的属性: 0

数据表

Test/Quality Data

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CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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