ATS-59002-C1-R0

Advanced Thermal Solutions
984-ATS-59002-C1-R0
ATS-59002-C1-R0

制造商：

说明：
散热片 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 25mm Comp, 25x32x13mm

数据表:
ECAD模型:
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供货情况

库存：
100 可于 20 天后发货
最少： 100   倍数： 100
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥287.02 ¥28,702.00
¥270.6463 ¥54,129.26

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
maxiFLOW
6.5 C/W
32 mm
25 mm
13 mm
商标: Advanced Thermal Solutions
颜色: Black
封装: Bulk
产品类型: Heat Sinks
系列: maxiGRIP HS ASM - Custom
工厂包装数量: 100
子类别: Heat Sinks
商标名: maxiFLOW maxiGRIP
类型: Component
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已选择的属性: 0

数据表

Test/Quality Data

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合规代码
CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99
原产地分类
原产国:
中国
组装原产国/地区:
不可用
扩散国家:
不可用
发货时，国家/地区可能会发生变化。

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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