ATS-59007-C1-R0

Name: Advanced Thermal Solutions ATS-59007-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59007-C1-R0
Price: 190.32 RMB
Availability: InStock

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Mouser编号：

984-ATS-59007-C1-R0

制造商编号：

ATS-59007-C1-R0

制造商：

Advanced Thermal Solutions

说明：

散热片 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 35mm Comp, 35x46x16mm

数据表:

ATS-59007-C1-R0 数据表 (PDF)

ECAD模型:

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库存量: 100

库存：: 100 可立即发货

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生产周期：: 8 周大于所示数量的预计工厂生产时间。

数量大于100的订购须受最低订购要求的限制。

输入数量：

最少： 1 倍数： 1

单价:

¥-.--

总价:

¥-.--

预估关税:

定价 (含13% 增值税)

数量	单价	总价
	¥215.0616	¥215.06
	¥190.5745	¥1,905.75
	¥181.5571	¥3,631.14
	¥174.9466	¥8,747.33
	¥167.0818	¥16,708.18
	¥158.9797	¥31,795.94
	¥154.6744	¥77,337.20

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产品属性	属性值	选择属性
制造商:	Advanced Thermal Solutions
产品种类:	散热片
RoHS:
产品:	Heat Sink Assemblies
设计目的:	BGA
安装风格:	Snap On
散热片材料:	Aluminum
散热片样式:	Angled Fin
热阻:	2.42 C/W
长度:	46 mm
宽度:	35 mm
高度:	16 mm
商标:	Advanced Thermal Solutions
颜色:	Black
封装:	Bulk
产品类型:	Heat Sinks
系列:	maxiGRIP HS ASM - Custom
工厂包装数量:	100
子类别:	Heat Sinks
商标名:	maxiFLOW maxiGRIP
类型:	Component

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已选择的属性: 0

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数据表

ATS-59007-C1-R0 数据表 (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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合规代码

CNHTS:: 7616991090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

原产地分类

原产国:: 中国
组装原产国/地区:: 不可用
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.