Heat Frame Assembly Kits

C/A Design Heat Frame Assembly Kits are manufactured from solid aluminum and can be designed for compliance with many industry standards. These kits allow users to navigate to the precise topography or skyline of their electronic printed circuit board while being ruggedized. When integrated with wedge locks and ejectors, these kits allow VME, cPCI, and other boards to fit in conduction-cooled chassis slot dimensions with zero insertion force. C/A Design Heat Frame Assembly Kits are ideal for defense, aerospace, and ruggedized/embedded solutions.