|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-20-4-03.5-L-A-TH-TR
- Samtec
-
1:
¥135.7356
-
25库存量
-
新产品
|
Mouser 零件编号
200-UDF6204035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
25库存量
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-20-3-03.5-L-A-TH-TR
- Samtec
-
1:
¥128.8878
-
25预期 2026/10/16
-
新产品
|
Mouser 零件编号
200-UDF6203035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
25预期 2026/10/16
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
60 Position
|
0.635 mm (0.025 in)
|
3 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-30-2-03.5-L-A-TH-TR
- Samtec
-
1:
¥144.0072
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDF6302035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
60 Position
|
0.635 mm (0.025 in)
|
2 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-30-4-03.5-L-A-TH-TR
- Samtec
-
1:
¥170.5735
-
25预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDF6304035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
25预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
120 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-2-01.5-L-A-TH-TR
- Samtec
-
1:
¥101.3497
-
25预期 2026/10/2
-
新产品
|
Mouser 零件编号
200-UDM6202015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/2
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
40 Position
|
0.635 mm (0.025 in)
|
2 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-2-06.5-L-A-TH-TR
- Samtec
-
1:
¥195.3318
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDM6202065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
40 Position
|
0.635 mm (0.025 in)
|
2 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-3-01.5-L-A-TH-TR
- Samtec
-
1:
¥108.9998
-
25预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDM6203015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
60 Position
|
0.635 mm (0.025 in)
|
3 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-4-01.5-L-A-TH-TR
- Samtec
-
1:
¥111.7005
-
25预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDM6204015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-5-01.5-L-A-TH-TR
- Samtec
-
1:
¥118.9777
-
25预期 2026/10/9
-
新产品
|
Mouser 零件编号
200-UDM6205015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/9
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
100 Position
|
0.635 mm (0.025 in)
|
5 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-5-06.5-L-A-TH-TR
- Samtec
-
1:
¥214.9599
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDM6205065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
100 Position
|
0.635 mm (0.025 in)
|
5 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-2-01.5-L-A-TH-TR
- Samtec
-
1:
¥120.9891
-
25预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDM6302015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
60 Position
|
0.635 mm (0.025 in)
|
2 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-2-06.5-L-A-TH-TR
- Samtec
-
1:
¥248.7356
-
25预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDM6302065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
60 Position
|
0.635 mm (0.025 in)
|
2 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-3-01.5-L-A-TH-TR
- Samtec
-
1:
¥128.1081
-
22预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDM6303015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
22预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
90 Position
|
0.635 mm (0.025 in)
|
3 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-4-01.5-L-A-TH-TR
- Samtec
-
1:
¥135.9277
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDM6304015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
120 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-5-01.5-L-A-TH-TR
- Samtec
-
1:
¥143.0467
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDM6305015LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
150 Position
|
0.635 mm (0.025 in)
|
5 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-20-2-03.5-L-A-TH-TR
- Samtec
-
1:
¥115.8589
-
25预期 2026/10/2
-
新产品
|
Mouser 零件编号
200-UDF6202035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
25预期 2026/10/2
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
40 Position
|
0.635 mm (0.025 in)
|
2 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-20-5-03.5-L-A-TH-TR
- Samtec
-
1:
¥155.5558
-
25预期 2026/10/14
-
新产品
|
Mouser 零件编号
200-UDF6205035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
25预期 2026/10/14
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
100 Position
|
0.635 mm (0.025 in)
|
5 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-30-3-03.5-L-A-TH-TR
- Samtec
-
1:
¥157.0361
-
22预期 2026/11/11
-
新产品
|
Mouser 零件编号
200-UDF6303035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
22预期 2026/11/11
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
90 Position
|
0.635 mm (0.025 in)
|
3 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-30-5-03.5-L-A-TH-TR
- Samtec
-
1:
¥183.4329
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDF6305035LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
150 Position
|
0.635 mm (0.025 in)
|
5 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-3-06.5-L-A-TH-TR
- Samtec
-
1:
¥205.2306
-
25预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDM6203065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
60 Position
|
0.635 mm (0.025 in)
|
3 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-20-4-06.5-L-A-TH-TR
- Samtec
-
1:
¥205.4905
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDM6204065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
80 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-3-06.5-L-A-TH-TR
- Samtec
-
1:
¥258.1259
-
25预期 2026/10/21
-
新产品
|
Mouser 零件编号
200-UDM6303065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/21
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
90 Position
|
0.635 mm (0.025 in)
|
3 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-4-06.5-L-A-TH-TR
- Samtec
-
1:
¥267.5953
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDM6304065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
120 Position
|
0.635 mm (0.025 in)
|
4 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
- UDM6-30-5-06.5-L-A-TH-TR
- Samtec
-
1:
¥278.6241
-
25预期 2026/10/22
-
新产品
|
Mouser 零件编号
200-UDM6305065LATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
|
|
25预期 2026/10/22
|
|
最低: 1
倍数: 1
|
|
|
Connectors
|
150 Position
|
0.635 mm (0.025 in)
|
5 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDM6
|
|
|
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
- UDF6-20-3-03.5-S-A-TH-TR
- Samtec
-
受限供货情况
-
新产品
|
Mouser 零件编号
200-UDF6203035SATHTR
新产品
|
Samtec
|
板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
|
|
|
|
|
|
|
Connectors
|
60 Position
|
0.635 mm (0.025 in)
|
3 Row
|
Solder
|
Vertical
|
15 A
|
200 VAC, 283 VDC
|
64 Gb/s
|
- 55 C
|
+ 125 C
|
Gold
|
Copper
|
Liquid Crystal Polymer (LCP)
|
64 Gb/s
|
UDF6
|
|