UDx6 AcceleRate® mP 0.635mm信号/电源阵列

Samtec UDx6 AcceleRate® mP 0.635mm信号/电源阵列采用0.635mm间距高密度、高速信号/电源阵列设计,可实现64Gbps PAM4速度。这些Samtech信号/电源阵列采用旋转式电源片设计,旨在提高性能并简化分线区域 (BOR)。这些UDx6 AcceleRate MP系列提供5mm和10mm两种堆叠高度,最多可支持10个电源位置和240个信号位置。信号/电源阵列采用开放式引脚设计,具有灵活的布线和接地功能。该系列包括可选对准引脚、用于与电路板牢固连接的标准焊接选项卡以及用于盲插配的极化导柱。

结果: 40
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 位置数量 节距 排数 端接类型 安装角 电流额定值 电压额定值 最大数据速率 最小工作温度 最大工作温度 触点电镀 触点材料 外壳材料 数据速率 系列
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket 25库存量
¥135.7356
¥123.2491
¥117.3731
¥111.8361
最低: 1
倍数: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25预期 2026/10/16
¥128.8878
¥116.4691
¥110.9095
¥105.6098
最低: 1
倍数: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25预期 2026/10/22
¥144.0072
¥130.7975
¥124.5486
¥118.6387
最低: 1
倍数: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25预期 2026/10/21
¥170.5735
¥156.0756
¥148.6967
¥141.5777
最低: 1
倍数: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/2
¥101.3497
¥90.852
¥85.8122
¥81.7216
最低: 1
倍数: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/22
¥195.3318
¥175.4325
¥165.7145
¥157.8045
最低: 1
倍数: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/21
¥108.9998
¥97.7111
¥92.2419
¥87.8914
最低: 1
倍数: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/21
¥111.7005
¥100.4005
¥95.5415
¥91.0215
最低: 1
倍数: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/9
¥118.9777
¥107.0901
¥101.9712
¥97.1009
最低: 1
倍数: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/22
¥214.9599
¥198.8009
¥189.3428
¥180.3028
最低: 1
倍数: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/21
¥120.9891
¥108.9094
¥103.7792
¥98.8411
最低: 1
倍数: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/21
¥248.7356
¥231.6274
¥220.6099
¥210.0896
最低: 1
倍数: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
22预期 2026/10/21
¥128.1081
¥115.7798
¥110.2089
¥105.0109
最低: 1
倍数: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/22
¥135.9277
¥123.1587
¥117.2488
¥111.7005
最低: 1
倍数: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/22
¥143.0467
¥129.9387
¥123.6785
¥117.859
最低: 1
倍数: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25预期 2026/10/2
¥115.8589
¥104.1408
¥99.1801
¥94.4115
最低: 1
倍数: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25预期 2026/10/14
¥155.5558
¥141.7359
¥134.9672
¥128.5488
最低: 1
倍数: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
22预期 2026/11/11
¥157.0361
¥143.1258
¥136.3571
¥129.837
最低: 1
倍数: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25预期 2026/10/22
¥183.4329
¥168.4039
¥160.4148
¥152.776
最低: 1
倍数: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/21
¥205.2306
¥184.303
¥174.1443
¥165.8049
最低: 1
倍数: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/22
¥205.4905
¥189.6818
¥180.6531
¥172.0538
最低: 1
倍数: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/21
¥258.1259
¥240.6674
¥229.1979
¥218.3386
最低: 1
倍数: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/22
¥267.5953
¥249.956
¥238.0571
¥226.678
最低: 1
倍数: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25预期 2026/10/22
¥278.6241
¥260.7362
¥248.3062
¥236.4977
最低: 1
倍数: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec 板对板与夹层连接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6