superGRIP™ clipKIT™ Heat Sink Attachments

Advanced Thermal Solutions superGRIP™ clipKIT™ Heat Sink Attachments promote a two-component system that quickly and securely mounts heat sinks to a range of hot-running Ball Grid Array (BGA) components. These attachments are ideal for densely populated PCBs with minimal space around mechanical attachment components. ATS superGRIP heat sink attachments eliminate the need to drill holes, which allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.