CompacLink™ Gen 5 Board-to-Board Connectors

Amphenol FCI CompacLink™ Gen 5 Board-to-Board Connectors are designed to link the system board and I/O boards via a bridge board or FPC in a notebook PC or industrial PC. These Gen 5 compression board-to-board connectors feature 1mm x 0.60mm pitch and 1.25mm low-profile height. The CompacLink connectors also feature high-density, high-speed interconnect solutions designed for board-to-board applications. The CompacLink board-to-board connectors can be secured with screws and provide flexibility for upgrading and repairing module designs in notebook PCs and industrial PCs.

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 位置数量 节距 端接类型 安装角 叠放高度 触点电镀 触点材料 外壳材料 封装
Amphenol FCI 板对板与夹层连接器 CompacLink Gen 5 Board-to-Board, 0.6x1mm Pitch, 250 position, 1.2mm, Stack Height
Mouser 目前在您所在地区不销售该产品。
Board to Board Connectors 155 Position 0.6 mm (0.024 in) Solder Straight 1.25 mm Gold Copper Thermoplastic (TP) Tray
Amphenol FCI 板对板与夹层连接器 CompacLink Gen 5 Board-to-Board, 0.6x1mm Pitch, 155 position, 1.2mm, Stack Height
Mouser 目前在您所在地区不销售该产品。
Board to Board Connectors 104 Position 0.6 mm (0.024 in) Solder Straight 1.25 mm Gold Copper Thermoplastic (TP) Tray
Amphenol FCI 板对板与夹层连接器 CompacLink Gen 5 Board-to-Board, 0.6x1mm Pitch, 105 position, 1.25mm Stack Height
Mouser 目前在您所在地区不销售该产品。
Board to Board Connectors 250 Position 0.6 mm (0.024 in) Solder Straight 1.25 mm Gold Copper Thermoplastic (TP) Tray