Hirose Electric Hirose BM10系列FPC对板连接器
Hirose BM10系列FPC对板连接器的堆叠高度为0.6mm或0.8mm，脚距为0.4mm，深度为2.98mm，可节省电路板空间。限幅触点设计可发出清晰的接触滴答声，为金属配件提供高度可靠的接触和保持力。BM10系列在接触位置设计有凹口，以增强防震效果和稳健性。Hirose BM10系列FPC对板连接器不仅提供焊芯保护，还可防尘，符合RoHs指令，不含卤。
特性
- 0.6mm or 0.8mm stacking height
- Space-saving design with 2.98mm depth
- Highly reliable contact and retention force with clipping contact design
- Clear tactile click with excellent contact design
- Shock-absorbing configuration with dimple on contact for robustness
- Contact protection against dust
- Enhanced self-alignment mechanism by guidance ribs (self-alignment range: 0.3mm)
- High PCB retention force with metal fittings
- Solder wicking prevention
- RoHS compliant, halogen-free product (satisfies halogen-free requirements defined as 900ppm maximum chlorine, 900ppm maximum bromine, and 1500ppm maximum total of chlorine and bromine)
Space-Saving Design
Resources
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发布日期: 2010-03-23
| 更新日期: 2025-09-30