Molex SlimStack Armor™ 板对板 SMT 连接器
莫仕 SlimStack Armor™ 0.35mm 板对板 SMT 连接器可通过保护性金属盖提供高达 3A 的额外电力。这款连接器为移动设备和其他紧密封装应用提供出色的插接导槽和电气接触保障。莫仕 SlimStack Armor 可节约空间，具有双触点设计，即使反复插拔，可也确保电气和机械可靠性。应用包括各种移动设备和医疗设备。
特性
- Full-armor housing protection prevents damage to the housing even when misaligned during mating
- Mating guidance with integrated metal power nails
- Provides up to 5.0A of power with superior contact assurance
- Overmolded contact terminals simplify assembly and improve the part structure and reliability
- Wide vacuum pick-and-place area accommodates automatic board placement even with narrow width
- Wide alignment area provides easy and secure mating
- 3-sided SMT offers improved solder strength
- Halogen-free and RoHS compliant
应用
- Consumer
- Wearable Devices
- Smart Phones
- Tablet PCs
- Portable Audio
- Portable Navigation Equipment
- IoT and smart home devices
- AR/VR devices
- 5G and RF devices
- Medical
- Patient Monitoring
- Therapeutic and Surgical
- Defense
- Unmanned vehicles
- Aircraft avionics
规范
- Electrical
- 50V maximum voltage
- 0.3A maximum current
- Up to 80mΩ maximum contact resistance
- 250VAC(rms) dielectric withstanding voltage
- 100MΩ minimum insulation resistance
- Mechanical
- 30 cycle durability
- 0.35mm pitch
- 2.00mm to 2.20mm in width
- 0.60mm to 1.00mm mated height range
- Vertical structure type
- Materials
- UL 94V-0 LCP black housing
- Copper alloy contacts
- Plating
- Gold on the contact and solder tail area
- Nickel on the underplating
- -40°C to +85°C operating temperature range
视频
Wide Alignment Area for Easy Mating
Dual Contact Design for Secure Reliability
Robust Power Nail with "Armor" Feature
View All
Molex SlimStack连接器系列
提供多种节省空间的表面贴装堆叠连接器。
Related Solutions
发布日期: 2015-02-03
| 更新日期: 2022-03-11