Parker Chomerics THERM-A-GAP™ PAD 30 3.2W/m-K Low Force Gap Pads
Parker Chomerics THERM-A-GAP™ PAD 30 Low Force Gap Pads provide 3.2W/m-K thermal conductivity, providing a universal solution for applications that require a moderate thermal performance in electronic device designs. This cost-effective solution is optimized for design flexibility, with several material carrier options and ease of customization for unusual shapes and sizes. The thermally conductive, electrically isolating gap filler pads combine heat transfer with low outgassing and low compression forces to deliver effective heat transfer between electronic devices, heat sinks, or other cooling features. Parker Chomerics THERM-A-GAP PAD 30 Low Force Gap Pads offer 30 Shore 00 hardness and are designed to maintain conformability in gaps due to uneven mating surfaces, rough surface textures, or air gaps. The "A" version features an aluminum foil carrier with pressure-sensitive adhesive (PSA) for permanent attachment.
Features
- Ultra-low compression force
- Superior thermal conductivity
- "A" version offers high-strength acrylic PSA for permanent attachment
- High tack surface reduces contact resistance
- UL 94V-0 flammability rating
- RoHS compliant
Applications
- Telecommunications equipment
- Consumer electronics
- Automotive electronic control units (ECUs)
- LEDs and lighting
- Power conversion
- Desktop computers, laptops, and servers
- Handheld devices
- Memory modules
- Vibration dampening
Specifications
- 0.020" to 0.200" (0.51mm to 5.08mm) standard thickness
- 2.9 specific gravity
- 30 Shore 00 hardness
- -67°C to +392°C operating temperature range
- 3.2W/m·K thermal conductivity
- 0.4°C-in2/W (2.6°C-cm2/W) thermal impedance at 10psi, at 0.04" (1mm) thick, "G" version
- 1.0J/g-K heat capacity
- 150ppm/K coefficient of thermal expansion
- 150kVac/5.9mm dielectric strength
- 1013Ω-cm volume resistivity
- 7.7 dielectric constant at 1000kHz
- 0.001 dissipation factor at 1000kHz
- 0.13% TML (0.03% CVCM) outgassing
Videos
Application Example
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Parker Chomerics THERM-A-GAP™ Thermally Conductive Pads
Designed for applications where heat must be conducted over large and variable gaps.