Parker Chomerics THERM-A-GAP™ PAD 60 6.0W/m-K Low Force Gap Pads
Parker Chomerics THERM-A-GAP™ PAD 60 Low Force Gap Pads offer 6.0W/m-K thermal conductivity, excellent heat transfer, and low compression forces, all while maintaining conformability between mating surfaces. These high-performance, thermally conductive gap filler pads provide an effective thermal interface between heat sinks and electronic devices where uneven surfaces, rough surface textures, and air gaps may exist. Additional features include ultra-low outgassing, UL 94V-0 flammability rating, and easy application. The "A" version of these gap pads has an aluminum foil carrier with pressure-sensitive adhesive (PSA) for permanent attachment. The THERM-A-GAP PAD 60 series from Parker Chomerics is ideal for 5G and telecom equipment, smart home devices, laptops, power supplies, and automotive electronic control units (ECUs).
Features
- Low compression force
- "A" version offers high-strength acrylic PSA for permanent attachment
- High thermal conductivity
- UL 94V-0 flammability rating
- RoHS compliant
Applications
- 5G and telecom equipment
- Smart home devices
- Automotive ECUs
- LEDs
- Power supplies
- Desktop computers, laptops, and servers
- Handheld devices
- Memory modules
- Vibration dampening
Specifications
- 0.040" to 0.200" (1mm to 5mm) standard thickness
- 3.3 specific gravity
- 40 Shore 00 hardness
- -67°C to +392°C operating temperature range
- 6.0W/m·K thermal conductivity
- 0.28°C-in2/W (1.8°C-cm2/W) thermal impedance at 10psi, at 0.04" (1mm) thick
- 1.0J/g-K heat capacity
- 150ppm/K coefficient of thermal expansion
- 125kVac/5.0mm dielectric strength
- 1013Ω-cm volume resistivity
- 9.3 dielectric constant at 1000kHz
- 0.006 dissipation factor at 1000kHz
- 0.05% TML (0.01% CVCM) outgassing
Application Example
Resources
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Parker Chomerics THERM-A-GAP™ Thermally Conductive Pads
Designed for applications where heat must be conducted over large and variable gaps.