Parker Chomerics THERM-A-GAP® PAD 80 8.3W/m-K Gap Pads
Parker Chomerics THERM-A-GAP® PAD 80 Gap Pads are thermally conductive, high-performance gap-filler pads with a typical thermal conductivity of 8.3W/m-K. These UL 94V-0-rated pads provide superior heat transfer across a variety of thicknesses and feature low compression forces and conformability between mating surfaces. The series is designed to serve as an effective thermal interface between heat sinks and heat-generating components in electronic devices, even across air gaps or on rough or uneven surfaces. Parker Chomerics THERM-A-GAP PAD 80 8.3W/m-K Gap Pads are available in standard thicknesses as low as 0.030" to 0.200" (0.76mm to 5.1mm). The lineup offers several material carriers, including an aluminum foil carrier with pressure-sensitive adhesive (PSA) for added strength during assembly.
Features
- Ultra-low compression force
- Electrically isolating
- Passes NASA outgassing requirements
- "A" version offers high-strength acrylic PSA for permanent attachment
- UL 94V-0 flammability rating
Applications
- 5G and telecom equipment
- Smart home devices
- Automotive electronics
- LEDs
- Power supplies
- Computing modules and servers
- Memory and data storage units
Specifications
- 0.020" to 0.200" (0.51mm to 5.10mm) standard thickness
- 3.4 specific gravity
- 35 Shore 00 hardness
- -67°C to +392°C operating temperature range
- 8.3W/m·K thermal conductivity
- 0.15°C-in2/W (0.97°C-cm2/W) thermal impedance at 10psi, at 0.04" (1mm) thick, unsupported
- 1.0J/g-K heat capacity
- 150ppm/K coefficient of thermal expansion
- 125kVac/5.0mm dielectric strength
- 1014Ω-cm volume resistivity
- 6.0 dielectric constant at 1000kHz
- 0.002 dissipation factor at 1000kHz
- 0.11% TML (0.09% CVCM) outgassing
Application Example
Resources
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Parker Chomerics THERM-A-GAP™ Thermally Conductive Pads
Designed for applications where heat must be conducted over large and variable gaps.