新款蓝牙模块 - 802.15.1

Fanstel BM20x Nordic nRF54LM20x BLUETOOTH® 6.0 Modules are compact, fully integrated wireless connectivity solutions based on Nordic Semiconductor's advanced nRF54LM20A and nRF54LM20B system-on-chip (SoC) platforms. Designed to accelerate the development of Bluetooth Low Energy (BLE), Thread, Zigbee®, and proprietary 2.4GHz wireless applications, the BM20x family combines a high-performance 128MHz Arm® Cortex®-M33 processor, 2036KB of flash memory, 512KB of RAM, integrated RF circuitry, and onboard crystals in a pre-certified module format that minimizes design complexity and time to market. Select models featuring the nRF54LM20B add an integrated Axon Neural Processing Unit (NPU), enabling edge AI capabilities for intelligent sensor processing and reduced cloud dependency.
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Fanstel BM20x Nordic nRF54LM20x BLUETOOTH® 6.0 ModulesBased on Nordic Semiconductor's advanced nRF54LM20A and nRF54LM20B system-on-chip (SoC) platforms.2026/9/14 -
u-blox ANNA-B5独立蓝牙®低功耗模块超紧凑型、高性能模块,封装尺寸为6.5 mm x 6.5 mm,适用于尺寸受限的应用。2026/6/12 -
Silicon Labs BGM270S 802.15.4无线模块基于系列2 EFR32BG27 SoC的安全、高性能无线低功耗BLUETOOTH®模块。2026/2/3 -
Fanstel Compact BC15 BLUETOOTH® 6.0 ModulesRobust, highly flexible, ultra-low-power BLE devices utilizing a Nordic nRF54L15 SoC.2025/12/5 -
Panasonic PAN B611-1 BLUETOOTH® 6.0低功耗 (LE) 模块基于Nordic nRF54L15,提供理想性能和存储容量的同时,最大限度地降低电流消耗。2025/11/6 -
Microchip Technology PIC32WM-BZ6多协议MCU模块支持低功耗BLUETOOTH® 5.2和IEEE 802.15.4 (Thread/Zigbee®)2025/11/3 -
Ezurio Aurawave AW100 Auracast™ PlatformEnables wireless broadcasting of high-quality audio to multiple BLUETOOTH® receivers simultaneously.2025/8/20 -
Digi XBee® 3 BLU模块适用于设计人员的易用解决方案,支持BLE 5.4,用于工业无线IoT连接。2025/8/8 -
Panasonic PAN1783/A蓝牙® 5.4 LE音频无线模块基于Nordic nRF5340单芯片控制器的先进无线解决方案。2025/5/6 -
Fanstel BM15x Nordic nRF54 Based ModulesRobust, highly flexible, ultra-low-power BLE modules utilizing Nordic nRF54L15 or nRF54L05 SoCs.2025/2/17 -
u-blox NORA-B2独立式BLE 6模块基于Nordic Semiconductor的nRF54 SoC,非常适合物联网应用。2024/11/9 -
Quectel HCM511S High-Performance BLUETOOTH® 5.4 ModulesFeatures an Arm® Cortex®-M33 processor running up to 76.8MHz and supports BLE 5.4.2024/9/10 -
Quectel HCM511S-TE-B BLUETOOTH® Development BoardDesigned for testing and developing the HCM511S module.2024/9/10 -
Microchip Technology WBZ350射频就绪多协议MCU模块安全的32位微控制器,内置BLUETOOTH® 和Zigbee® 无线功能。2024/7/12 -
Microchip Technology RNBD350蓝牙®低功耗模块该模块提供了实施蓝牙® 5.2低功耗连接的完整解决方案。2024/6/28 -
Microchip Technology PIC32CX-BZ3和WBZ351 MCU模块集成了16MHz晶体,工作电压范围为1.9V至3.6V。2024/3/22 -
Murata 蓝牙®模块该模块可为智能手机、平板电脑及笔记本电脑等终端设备提供多种低功耗直连解决方案。2024/3/19 -
Silicon Labs xGM260P 无线模块具有出色的射频性能,优化用于电池供电IoT设备。2024/2/26 -
u-blox ANNA-B112独立蓝牙® 5模块超紧凑型SiP,采用蓝牙® 5和带FPU的Arm® Cortex®-M4微处理器。2024/2/12 -
Infineon Technologies CYW20822蓝牙®低功耗模块完全集成的BLUETOOTH® LE无线模块,预装有EZ串行固件。2024/2/2 -
Renesas Electronics DA14535MOD SmartBond TINY BLUETOOTH®低功耗模块具有高达+3 dBm的发射Pout 、64 KB RAM、160 KB ROM和12 KB OTP。2024/1/2 -
Ezurio Sera NX040超宽带和蓝牙LE模块针对低功耗运行进行优化,减少对外部时钟、滤波器和元器件的需求。2023/12/22 -
Globalscale Technologies GTI-ATM3330e Extreme Low Power BLUETOOTH® 5.3 SoCA low-power solution from the Wireless SoC Series.2023/12/12 -
Renesas Electronics DA14592MOD Bluetooth®低功耗 (BLE) 模块包括实施BLE解决方案所需的所有外部元件,并带有正交解码器。2023/12/6 -
Renesas Electronics DA14592 SmartBee™ BLE SoC,带嵌入式闪存CM33F(64MHz)作为应用内核,CM0+(64MHz)作为可配置MAC。2023/12/6 -
