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ATS-1043-C3-R0

Name: Advanced Thermal Solutions ATS-1043-C3-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-1043-C3-R0
Price: 200.86 RMB
Availability: InStock

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Mouser编号：

984-ATS-1043-C3-R0

制造商编号：

ATS-1043-C3-R0

制造商：

Advanced Thermal Solutions

说明：

散热片 maxiFLOW BGA Heat Sink+Plastic pushPIN, Cross-Cut, 40.89x45x25mm, 1.60C/W, High

数据表:

ATS-1043-C3-R0 数据表 (PDF)

ECAD模型:

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产品属性	属性值	选择属性
制造商:	Advanced Thermal Solutions
产品种类:	散热片
RoHS:
产品:	Heat Sinks
设计目的:	BGA
安装风格:	Push Pin
散热片材料:	Aluminum
散热片样式:	Rectangular Fin
热阻:	1.60 deg C/W
长度:	1.610" (40.89mm)
宽度:	1.772" (45.00mm)
高度:	0.984" (25.00mm)
类型:	Top Mount
商标:	Advanced Thermal Solutions
颜色:	Green
封装:	Bulk
产品类型:	Heat Sinks
系列:	maxiFLOW XCut PushPIN
工厂包装数量:	100
子类别:	Heat Sinks
商标名:	maxiFLOW pushPIN
单位重量:	16.300 g

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已选择的属性: 0

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数据表

ATS-1043-C3-R0 数据表 (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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合规代码

CNHTS:: 7616991090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

原产地分类

原产国:: 中国
组装原产国/地区:: 不可用
扩散国家:: 不可用

发货时，国家/地区可能会发生变化。

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

maxiFLOW™ Cross-Cut Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Cross-Cut Heat Sinks feature a spread-fin array to maximize surface-area cooling and deliver excellent thermal performance. Effective convection cooling from the spread-fin arrays enables a 20% lower junction temperature and a 40% reduction in thermal resistance compared to straight-fin and pin-fin sinks. Whenever higher cooling capacity is required, maxiFLOW heat sinks with thermal tape can be used, and the double-sided adhesive thermal tape enables the attachment of the heat sink to the device. Advanced Thermal Solutions maxiFLOW Cross-Cut Heat Sinks meet the thermal requirements of various electronics packages, including BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, and LQFP.