conga-TCRP1/HSP-HP-T

conga-TCRP1 COM® Express 3.1 Type 6 Modules

congatec conga-TCRP1 COM^® Express 3.1 Type 6 Modules are ideal for cost-sensitive designs that require a highly flexible and scalable embedded computing platform. These AMD Ryzen™ Artificial Intelligence (AI) Embedded P100 COM Express 3.1 Type 6 compact modules allow users to seamlessly scale from 4 to 12 CPU cores and from 2 to 16 graphics compute units. These performance features allow the conga-TCRP1 to balance CPU, graphics processing unit (GPU), and neural processing unit (NPU) resources. One module variant can be used for various designs, ranging from passively cooled, fully enclosed designs for robust handheld devices and hygienic medical PCs to mission computers for harsh environments and high-performance system designs. These congtec COM Express compact modules leverage AMD Zen 5 and Zen 5c CPU architecture with 4nm technology, delivering enhanced determinism for real-time and latency-sensitive workloads. A Radeon RDNA 3.5™ GPU and the XDNA2™ NPU contribute up to 50TOPS of AI compute capability. This computing architecture accelerates performance-intensive and deterministic edge AI applications, including transportation, medical technology, smart city infrastructures, gaming, robotics, and industrial automation.