Parker Chomerics THERM-A-GAP™ Thermally Conductive Pads are designed for applications where heat must be conducted over large and variable gaps between a semiconductor component and a heat-dissipating surface. This family of low soft, thermally conductive silicone and non-silicone elastomers provides excellent thermal properties and high conformability at low clamping forces. These thermally conductive gap-filler sheets and pads from Parker Chomerics reduce stress on components and can blanket multiple components for superior coverage. The thicker pads also help improve vibration dampening in applications. The product line is ideal for a wide range of applications, including telecommunications and 5G equipment, lighting, computers, handheld devices, and automotive electronic control units (ECUs).
