Parker Chomerics THERM-A-GAP™ GEL 75 Dispensable Gels feature a high-performance, single-component, thermal interface material with 7.5W/m-K thermal conductivity. The heavy, paste-like consistency enables controlled dispensing and allows application in variable thicknesses to suit various application requirements. These dispensable gels are designed to conduct heat from electronics to a heat sink or enclosure and require only ultra-low compression force to deform under assembly pressure. The low force minimizes stress to components, solder joints, and leads. Parker Chomerics THERM-A-GAP GEL 75 Dispensable Gels do not require secondary curing and are reworkable for easy application.
