Parker Chomerics THERM-A-GAP® PAD 70TP Thermal Putty Sheets offer a typical thermal conductivity of 7.0W/m-K for superior thermal performance and long-term stability compared to conventional thermal pads. These high-performance, thermally conductive gap filler pads feature ultra-low compression force and are highly conformable. The putty sheets deliver effective heat transfer between electronic components and their associated cooling features, such as heat sinks. Unlike other gap pads, the PAD 70TP material is designed for static, one-time assembly, as it permanently conforms to displace air gaps caused by uneven surfaces or rough textures. Parker Chomerics THERM-A-GAP PAD 70TP 7W/m-K Thermal Putty Sheets feature an aluminum foil carrier with an acrylic pressure-sensitive adhesive (PSA) on one side.
