TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

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数量 RoHS 产品
类型
合金
封装类型
Chip Quik 焊料 Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
数据表
239库存量
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik 焊料 Paste No-Clean 15g Sn63/Pb37 T4
数据表
344库存量
最低： 1
倍数： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik 焊料 Paste No-Clean 35g Sn63/Pb37 T4
数据表
391库存量
最低： 1
倍数： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik 焊料 Paste No-Clean 250g Sn63/Pb37 T4
数据表
139库存量
最低： 1
倍数： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik 焊料 Paste No-Clean 50g Sn63/Pb37 T4
数据表
574库存量
最低： 1
倍数： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik 焊料 Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
数据表
267库存量
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik 焊料 Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
数据表
137库存量
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik 焊料 Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
数据表
51库存量
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik 焊料 Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
数据表
256库存量
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik 焊料 Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
数据表
149库存量
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik 焊料 Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
数据表
197库存量
254预期 2026/9/10
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik 焊料 Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
数据表
49库存量
262在途量
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik 焊料 Paste No-Clean 500g Sn63/Pb37 T4
数据表
12预期 2026/9/23
最低： 1
倍数： 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik 焊料 Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
数据表
无库存交货期 6 周
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik 焊料 Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
数据表
N/A
最低： 1
倍数： 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge