ARM Cortex-M33 核心 无线与射频模块

无线和射频模块类型

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS 产品类型 产品 频率 接口类型 协议 - 蓝牙、BLE - 802.15.1 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 协议 - Sub GHz
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
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Multiprotocol Modules 2.4 GHz I2C, UART Thread, Zigbee
Fanstel BM05M
Fanstel 蓝牙模块 - 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna
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Bluetooth Modules I2C, SPI
Silex Technology 多协议模块 Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
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Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Silex Technology 多协议模块 IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
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Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Silex Technology 多协议模块 the option to attach an antenna via a trace. does not include the u.Fl connector
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Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Silex Technology 多协议模块 the option to attach an antenna via a trace does not include the u.Fl connector
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Multiprotocol Modules Multiprotocol Modules 260 MHz I2C, SPI, UART 802.11 a/b/g/n/ac/ax
Quectel 蓝牙模块 - 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105?
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Bluetooth Modules 78 MHz I2C, SPI, UART Bluetooth
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
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Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
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Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
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Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel 多协议模块 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
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Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
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Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 802.11a/b/g/n/ac/ax
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
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Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB