2 Mb/s 嵌入式解决方案

嵌入式解决方案类型

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结果: 126
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
Silicon Labs 多协议模块 MGM13S02F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 无库存交货期 24 周
最低: 1,000
倍数: 1,000
: 1,000

Silicon Labs 多协议模块 MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 无库存交货期 24 周
最低: 1,000
倍数: 1,000
: 1,000

Silicon Labs 多协议模块 MGM13S02F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 无库存交货期 24 周
最低: 1,885
倍数: 1,885

Silicon Labs 多协议模块 MGM13S12F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connec 无库存交货期 24 周
最低: 1,000
倍数: 1,000
: 1,000

Silicon Labs 多协议模块 MGM13S12F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 无库存交货期 24 周
最低: 1,000
倍数: 1,000
: 1,000

Silicon Labs 多协议模块 MGM13S12F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connec 无库存交货期 24 周
最低: 1,885
倍数: 1,885

Silicon Labs 多协议模块 MGM13S12F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 无库存交货期 24 周
最低: 1,885
倍数: 1,885

Silicon Labs 多协议模块 MGM220P wireless gecko 无库存交货期 20 周
最低: 1,000
倍数: 1,000
: 1,000

Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 无库存交货期 20 周
最低: 1
倍数: 1

NXP Semiconductors 多协议模块 IW610GUK/A1ZDI

NXP Semiconductors 多协议模块 IW610BUK/A1ZDI

Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins

Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP

Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP

Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins

Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins

NXP Semiconductors 多协议模块 IW610CUK/A1ZDI

NXP Semiconductors 多协议模块 IW610FUK/A1ZDI

Fanstel 多协议模块 Mini nRF52811 BLE 5.4 module, 192KB flash,24KB RAM, high performance PCB antenna, approtect

NXP Semiconductors 多协议模块 IW610BHN/A1ZDI

NXP Semiconductors 多协议模块 IW610CHN/A1ZDI

NXP Semiconductors 多协议模块 IW610FHN/A1ZDI

Murata Electronics 多协议模块 Type 2NR BLE Module

Phoenix Contact 调制解调器 PSI-MODEM- SHDSL/SERIAL

Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this