|
|
模块化系统 - SOM ConnectCore MP255 STM32MP255C, Dual A35 1.2GHz, M33, GPU, ISP, NPU, 8GB eMMC, 1GB DDR4, -40/+85C
- CC-ST-J17D-ZK
- Digi
-
1:
¥834.6067
-
76预期 2026/11/16
|
Mouser 零件编号
888-CC-ST-J17D-ZK
|
Digi
|
模块化系统 - SOM ConnectCore MP255 STM32MP255C, Dual A35 1.2GHz, M33, GPU, ISP, NPU, 8GB eMMC, 1GB DDR4, -40/+85C
|
|
76预期 2026/11/16
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
|
|
|
|
|
模块化系统 - SOM ConnectCore 93 Dual, i.MX 93 Dual A55, M33, NPU, 1GB LPDDR4, 8GB eMMC, -40/+85C, Wi-Fi 802.11ax, Bluetooth 5.3
- CC-WMX-YC7D-KN
- Digi
-
1:
¥1,167.0414
-
45预期 2026/11/3
|
Mouser 零件编号
888-CC-WMX-YC7D-KN
|
Digi
|
模块化系统 - SOM ConnectCore 93 Dual, i.MX 93 Dual A55, M33, NPU, 1GB LPDDR4, 8GB eMMC, -40/+85C, Wi-Fi 802.11ax, Bluetooth 5.3
|
|
45预期 2026/11/3
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
|
|
|
|
|
模块化计算机 - COM The QSMP2 is a solderable Sytem on Module with a size of only 29 by 29 mm.
- QSMP-2550
- Ka-Ro electronics
-
1:
¥934.0241
-
29在途量
-
新产品
|
Mouser 零件编号
951-QSMP-2550
新产品
|
Ka-Ro electronics
|
模块化计算机 - COM The QSMP2 is a solderable Sytem on Module with a size of only 29 by 29 mm.
|
|
29在途量
|
|
最低: 1
倍数: 1
|
|
Computer-On-Modules - COM
|
|
|
|
|
|
模块化计算机 - COM JUMPtec COMe-mEL10 E2 x6212RE 4G/16G
- 34013-0416-R1-2
- JUMPtec
-
1:
¥3,526.9221
-
19在途量
|
Mouser 零件编号
168-34013-0416-R1-2
|
JUMPtec
|
模块化计算机 - COM JUMPtec COMe-mEL10 E2 x6212RE 4G/16G
|
|
19在途量
|
|
最低: 1
倍数: 1
|
|
Computer-On-Modules - COM
|
Atom x6212RE
|
Intel
|
|
|
|
模块化系统 - SOM FPGA-Modul with AMD Artix 7A100T-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
- TE0712-03-71I36-A
- Trenz Electronic
-
1:
¥2,597.2824
-
6预期 2027/1/13
|
Mouser 零件编号
287-TE071203-71I36-A
|
Trenz Electronic
|
模块化系统 - SOM FPGA-Modul with AMD Artix 7A100T-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
|
|
6预期 2027/1/13
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
XC7A100T-1FGG484I
|
Xilinx
|
|
|
|
模块化系统 - SOM SoC Module with AMD Zynq 7015-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
- TE0715-05-51I33-A
- Trenz Electronic
-
1:
¥3,134.9364
-
4预期 2027/4/20
|
Mouser 零件编号
287-TE071505-51I33-A
|
Trenz Electronic
|
模块化系统 - SOM SoC Module with AMD Zynq 7015-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
|
|
4预期 2027/4/20
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
XC7Z015-1CLG485I
|
Xilinx
|
|
|
|
模块化系统 - SOM SoC Module with AMD Zynq 7030-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
- TE0715-05-71I33-A
- Trenz Electronic
-
1:
¥4,665.1824
-
16在途量
|
Mouser 零件编号
287-TE071505-71I33-A
|
Trenz Electronic
|
模块化系统 - SOM SoC Module with AMD Zynq 7030-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
|
|
16在途量
在途量:
1 预期 2026/9/18
15 预期 2026/10/9
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
XC7Z030-1SBG485I
|
Xilinx
|
|
|
|
模块化系统 - SOM SoC-Module with AMD Zynq 7020-2I, 1 GByte DDR3L, 8 GByte eMMC, 4 x 5 cm
- TE0720-04-62I33MA
- Trenz Electronic
-
1:
¥2,907.716
-
30预期 2027/9/15
|
Mouser 零件编号
287-TE07200462I33MA
|
Trenz Electronic
|
模块化系统 - SOM SoC-Module with AMD Zynq 7020-2I, 1 GByte DDR3L, 8 GByte eMMC, 4 x 5 cm
|
|
30预期 2027/9/15
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
ARM Cortex A9
|
AMD / Xilinx
|
|
|
|
模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
- OSD32MP157C-512M-IAA
- Octavo Systems
-
1:
¥690.3509
-
168预期 2026/11/10
|
Mouser 零件编号
415-O32MP157C512MIAA
|
Octavo Systems
|
模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
|
|
168预期 2026/11/10
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
STM32MP157C
|
STMicroelectronics
|
|
|
|
模块化系统 - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
- OSD3358-512M-BCB
- Octavo Systems
-
1:
¥464.0345
-
120在途量
|
Mouser 零件编号
415-OSD3358-512M-BCB
|
Octavo Systems
|
模块化系统 - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
|
|
120在途量
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
AM3358
|
Texas Instruments
|
|
|
|
单板计算机 MIO-2361 A101-2 APL-E3950 F1, RAM 4GB, e
- MIO-2361EW-S7A2
- Advantech
-
1:
¥11,187.9153
-
5预期 2026/12/24
|
Mouser 零件编号
923-MIO-2361EW-S7A2
|
Advantech
|
单板计算机 MIO-2361 A101-2 APL-E3950 F1, RAM 4GB, e
|
|
5预期 2026/12/24
|
|
最低: 1
倍数: 1
|
|
Single Board Computers
|
Atom E3950
|
Intel
|
|
|
|
模块化计算机 - COM iMX8ULP OSM V11 S module, 1GB DDR, 16G
- ROM-2620WD-MDA1E
- Advantech
-
1:
¥826.1656
-
108预期 2026/9/24
|
Mouser 零件编号
923-ROM-2620WD-MDA1E
|
Advantech
|
模块化计算机 - COM iMX8ULP OSM V11 S module, 1GB DDR, 16G
|
|
108预期 2026/9/24
|
|
最低: 1
倍数: 1
|
|
Computer-On-Modules - COM
|
i.MX 8ULP
|
NXP
|
|
|
|
模块化计算机 - COM QSXP/ML8C/2GS/8GF/E85 socketed module
- QSXP-ML81/SOCK
- Ka-Ro electronics
-
1:
¥1,474.085
-
9预期 2027/2/5
|
Mouser 零件编号
951-QSXP-ML81/SOCK
|
Ka-Ro electronics
|
模块化计算机 - COM QSXP/ML8C/2GS/8GF/E85 socketed module
|
|
9预期 2027/2/5
|
|
最低: 1
倍数: 1
|
|
Computer-On-Modules - COM
|
i.MX 8M Plus
|
NXP
|
|
|
|
模块化计算机 - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU, 4 GB LPDDR4 , 32 GB eMMC, -40 C to 85 C
- LEC-iMX8MP-Q-N-4G-32G-ER
- ADLINK Technology
-
1:
¥5,211.8199
-
3预期 2026/11/18
|
Mouser 零件编号
976-LECIMX8MN4G32GER
|
ADLINK Technology
|
模块化计算机 - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU, 4 GB LPDDR4 , 32 GB eMMC, -40 C to 85 C
|
|
3预期 2026/11/18
|
|
最低: 1
倍数: 1
|
|
Computer-On-Modules - COM
|
i.MX 8M Plus
|
NXP
|
|
|
|
模块化系统 - SOM AMD/Xilinx Artix 7 XC7A100T-2CSG324C, 512 MByte DDR3, dual 100 MBit Ethernet PHY
- TE0710-03-72C21-A
- Trenz Electronic
-
1:
¥1,935.5544
-
1预期 2026/9/25
|
Mouser 零件编号
287-TE0710-03-72C21A
|
Trenz Electronic
|
模块化系统 - SOM AMD/Xilinx Artix 7 XC7A100T-2CSG324C, 512 MByte DDR3, dual 100 MBit Ethernet PHY
|
|
1预期 2026/9/25
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
|
|
|
|
|
模块化计算机 - COM QSMP2/SOCK is a socketed version of the QSMP2 Sytem on Module. QS00-SV05 needed.
- QSMP-2550/SOCK
- Ka-Ro electronics
-
1:
¥990.2755
-
8在途量
-
新产品
|
Mouser 零件编号
951-QSMP-2550SOCK
新产品
|
Ka-Ro electronics
|
模块化计算机 - COM QSMP2/SOCK is a socketed version of the QSMP2 Sytem on Module. QS00-SV05 needed.
|
|
8在途量
|
|
最低: 1
倍数: 1
|
|
Computer-On-Modules - COM
|
|
|
|
|
|
模块化系统 - SOM High IO FPGA Module with AMD Artix 7A35T-2I, USB, 4 x 5 cm
- TE0711-02-42I-1-A
- Trenz Electronic
-
1:
¥1,108.3944
-
2预期 2027/7/2
|
Mouser 零件编号
287-TE0711-02-42I-1A
|
Trenz Electronic
|
模块化系统 - SOM High IO FPGA Module with AMD Artix 7A35T-2I, USB, 4 x 5 cm
|
|
2预期 2027/7/2
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
XC7A35T-2CSG324I
|
AMD
|
|
|
|
模块化系统 - SOM SoM with AMD Zynq 7030-1I, 1 GByte DDR3L, 5.2 x 7.6 cm
- TE0745-03-71I31-A
- Trenz Electronic
-
1:
¥4,790.2508
-
2预期 2026/10/13
|
Mouser 零件编号
287-TE0745-03-71I31A
|
Trenz Electronic
|
模块化系统 - SOM SoM with AMD Zynq 7030-1I, 1 GByte DDR3L, 5.2 x 7.6 cm
|
|
2预期 2026/10/13
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
ARM Cortex-A9
|
AMD
|
|
|
|
模块化系统 - SOM MAX1000 - IoT Maker Board, 8kLE, 8 MByte SDRAM, 8 MByte Flash, 6.15 x 2.5 cm
- TEI0001-04-DBC87A
- Trenz Electronic
-
1:
¥363.9504
-
22在途量
-
新产品
|
Mouser 零件编号
287-TEI000104-DBC87A
新产品
|
Trenz Electronic
|
模块化系统 - SOM MAX1000 - IoT Maker Board, 8kLE, 8 MByte SDRAM, 8 MByte Flash, 6.15 x 2.5 cm
|
|
22在途量
在途量:
1 预期 2026/10/7
13 预期 2026/12/4
4 预期 2027/3/19
4 预期 2027/3/26
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
|
Altera, Intel
|
|
|
|
模块化系统 - SOM
- N8MP_SOM_4r16eWB_i
- Ezurio
-
1:
¥1,709.5092
-
1在途量
|
Mouser 零件编号
564-QPLUSSOM4R16EWBI
|
Ezurio
|
模块化系统 - SOM
|
|
1在途量
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
i.MX 8M Plus Quad
|
NXP
|
|
|
|
模块化系统 - SOM 模块化系统 - SOM Xilinx Zynq UltraScale ZU3EG, 4GB DDR4, 4GB eMMC
- MYC-CZU5EV-V2-4E4D-1200-I-FAN
- MYIR
-
1:
¥7,285.788
-
3预期 2026/9/24
|
Mouser 零件编号
885-MYCCZU5EVV2FAN
|
MYIR
|
模块化系统 - SOM 模块化系统 - SOM Xilinx Zynq UltraScale ZU3EG, 4GB DDR4, 4GB eMMC
|
|
3预期 2026/9/24
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
Zynq UltraScale+ ZU5EV
|
Xilinx
|
|
|
|
模块化系统 - SOM 512MB DDR3, 4GB eMMC, industrial
- MYC-Y7Z010-V2-4E512D-667-I
- MYIR
-
1:
¥1,186.4774
-
52预期 2026/9/17
|
Mouser 零件编号
885-MYCY7ZV24E512D6I
|
MYIR
|
模块化系统 - SOM 512MB DDR3, 4GB eMMC, industrial
|
|
52预期 2026/9/17
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
XC7Z010
|
Xilinx
|
|
|
|
模块化系统 - SOM LPC1788 OEM BOARD SODIMM
- EA-OEM-009
- Embedded Artists
-
1:
¥1,591.04
-
无库存交货期 2 周
|
Mouser 零件编号
924-EA-OEM-009
|
Embedded Artists
|
模块化系统 - SOM LPC1788 OEM BOARD SODIMM
|
|
无库存交货期 2 周
|
|
|
¥1,591.04
|
|
|
¥1,373.8314
|
|
|
¥1,330.4846
|
|
|
¥1,330.236
|
|
|
查看
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
LPC1788
|
NXP
|
|
|
|
模块化系统 - SOM 模块化系统 - SOM T113-S3, 128 MB DDR4, 8GB eMMC
- MYC-YT113S3-4E128D-110-I
- MYIR
-
1:
¥439.4683
-
7预期 2026/10/6
|
Mouser 零件编号
885-MYC4E128D110I
|
MYIR
|
模块化系统 - SOM 模块化系统 - SOM T113-S3, 128 MB DDR4, 8GB eMMC
|
|
7预期 2026/10/6
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
|
|
|
|
|
模块化系统 - SOM Zynq UltraScale+ ZU4EV (-1 Speed) MPSoC SOM with 2GB PS DDR4 with ECC, 1GB FPGA DDR4, 8GB eMMC - boot code
- iW-G30M-C4EV-4E002G-E008G-BIA
- iWave Global
-
1:
¥10,730.5817
-
无库存交货期 8 周
|
Mouser 零件编号
136-IWAVE0117
|
iWave Global
|
模块化系统 - SOM Zynq UltraScale+ ZU4EV (-1 Speed) MPSoC SOM with 2GB PS DDR4 with ECC, 1GB FPGA DDR4, 8GB eMMC - boot code
|
|
无库存交货期 8 周
|
|
最低: 1
倍数: 1
|
|
System-On-Modules - SOM
|
Zynq Ultrascale+
|
Xilinx
|
|