模块化计算机 - COM

结果: 324
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 外观尺寸 处理器品牌 处理器类型 芯片组 频率 RAM最大容量 已安装RAM 高速缓冲存储器 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸
congatec 模块化计算机 - COM COM-HPC client module based on Intel Core i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset QM580E.
COM-HPC Size B Intel Core i7-11850HE QM580E 2.6 GHz to 4.7 GHz 24 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB 0 C + 60 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Core i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset QM580E.
COM-HPC Size B Intel Core i5-11500HE QM580E 2.6 GHz to 4.5 GHz 12 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB 0 C + 60 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Core i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset HM570E.
COM-HPC Size B Intel Core i3-11100HE HM570E 2.4 GHz to 4.4 GHz 8 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB 0 C + 60 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Celeron Processor 6600HE dual-core processor with 2.6GHz, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset HM570E.
COM-HPC Size B Intel Celeron 6600HE HM570E 2.6 GHz 8 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB 0 C + 60 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
COM-HPC Size B Intel Xeon W-11865MRE RM590E 2.6 GHz to 4.7 GHz 24 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
COM-HPC Size B Intel Xeon W-11555MRE RM590E 2.6 GHz to 4.5 GHz 12 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
COM-HPC Size B Intel Xeon W-11155MRE RM590E 2.4 GHz to 4.4 GHz 8 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

COM-HPC Size B Intel Xeon W-11865MLE RM590E 1.5 GHz to 4.5 GHz 24 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
COM-HPC Size B Intel Xeon W-11555MLE RM590E 1.9 GHz to 4.4 GHz 12 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 120 mm x 120 mm
congatec 模块化计算机 - COM COM-HPC client module based on Intel Xeon Processor W-11155MLE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset
COM-HPC Size B Intel Xeon W-11155MLE RM590E 1.8 GHz to 3.1 GHz 8 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 120 mm x 120 mm
congatec 模块化计算机 - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.8GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.
SMARC v2.1 NXP i.MX 8M Plus Quad 1.8 GHz Audio, CAN, Ethernet, GPIO, I2C, PCIe, UART, USB 0 C + 60 C 82 mm x 50 mm
congatec 模块化计算机 - COM

SMARC v2.1 NXP i.MX 8M Plus Quad 1.6 GHz Audio, CAN, Ethernet, GPIO, I2C, PCIe, UART, USB - 40 C + 85 C 82 mm x 50 mm
congatec 模块化计算机 - COM SMARC 2.1 module with Intel Core i3-N305 8-core processor with 1.0GHz core frequency up to 3.8GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Commercial grade temperaturerange from 0C to 60C.

SMARC v2.1 Intel Core i3-N305 1.8 GHz 16 GB 16 GB DP, eDP, eSPI, Ethernet, GPIO, HDMI, I2C, I2S, LVDS, PCIe, SATA, SMBus, SPI, UART, USB 2.0, USB 3.0 0 C + 60 C 82 mm x 50 mm
congatec 模块化计算机 - COM SMARC 2.1 module with Intel Atom x7425E 4-core processor with 1.5GHz core frequency up to 3.4GHz (turbo), 8GB 4800MT/s LPDDR5 onboard memory and 32GB eMMC 5.1 onboard flash. Commercial grade temperature range from 0 C to 60 C.

SMARC v2.1 Intel Atom x7425E 1.5 GHz 16 GB 8 GB DP, eDP, eSPI, Ethernet, GPIO, HDMI, I2C, I2S, LVDS, PCIe, SATA, SMBus, SPI, UART, USB 2.0, USB 3.0 0 C + 60 C 82 mm x 50 mm
congatec 模块化计算机 - COM SMARC 2.1 module with Intel Core 3 N355 8-core processor with 1.9GHz core frequency up to 3.9GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Commercial grade temperaturerange from 0 C to 60 C.
SMARC Specification 2.2 Intel Core3-N355 1.9 GHz I2C, PCIe, SCI, SPI, UART, USB 0 C + 60 C 82 mmx 50 mm
congatec 模块化计算机 - COM SMARC 2.1 module with Intel Atom x7211RE 2-core processor with 1.0GHz core frequency up to 3.2GHz (turbo), 4GB 4800MT/s LPDDR5 onboard memory and 32GB eMMC 5.1 onboard flash. Industrial grade temperature range from -40 C to 85 C.
SMARC Specification 2.2 Intel X7211RE I2C, PCIe, SCI, SPI, UART, USB - 40 C + 85 C 82 mmx 50 mm
congatec 模块化计算机 - COM SMARC 2.1 module with Intel Atom x7433RE 4-core processor with 1.5GHz core frequency up to 3.4GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Industrial grade temperaturerange from -40 C to 85 C.
SMARC Specification 2.2 Intel X7433RE 1.5 GHz I2C, PCIe, SCI, SPI, UART, USB - 40 C + 85 C 82 mmx 50 mm
congatec 模块化计算机 - COM SMARC 2.1 module with Intel Atom x7425E 4-core processor with 1.5GHz core frequency up to 3.4GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Commercial grade temperaturerange from 0 C to 60 C.
SMARC Specification 2.2 Intel X7425E 1.5 GHz I2C, PCIe, SCI, SPI, UART, USB 0 C + 60 C 82 mmx 50 mm
congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P185 processor with 12Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 16 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +
COM Express Compact AMD AMD Ryzen AI Embedded P185 5.1 GHz 96 GB GPIO, I2C, SPI, UART, USB 0 C + 60 C 95 mm x 95 mm
congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P174 processor with 10Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 12 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +
COM Express Compact AMD AMD Ryzen AI Embedded P174 5 GHz 96 GB GPIO, I2C, SPI, UART, USB 0 C + 60 C 95 mm x 95 mm
congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P164 processor with 8Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 12 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +6
COM Express Compact AMD AMD Ryzen AI Embedded P164 5 GHz 96 GB GPIO, I2C, SPI, UART, USB 0 C + 60 C 95 mm x 95 mm
congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P132 processor with 6Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 4 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +60
COM Express Compact AMD AMD Ryzen AI Embedded P132 4.5 GHz 96 GB GPIO, I2C, SPI, UART, USB 0 C + 60 C 95 mm x 95 mm
congatec 模块化计算机 - COM COM Express Compact module based on AMD Ryzen AI Embedded P121 processor with 4Cores Integrated XDNA 2 NPU Integrated RDNA 3.5 Graphics with 2 CUs Dual channelSODIMM DDR5 5600 MT/s memory interface Commercial grade temperature range from 0Cto +60
COM Express Compact AMD AMD Ryzen AI Embedded P121 4.4 GHz 96 GB GPIO, I2C, SPI, UART, USB 0 C + 60 C 95 mm x 95 mm
congatec 模块化计算机 - COM PTT: COM Express Type 6 Compact module based on AMD Ryzen Embedded xxxxx with 12 cores 2.0GHz up to 5.1GHz (boost) Integrated XDNA2 NPU Integrated RDNA 3.5 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial tempe
COM Express Compact AMD PTT-370 24 MB
congatec 模块化计算机 - COM PTT: COM Express Type 6 Compact module based on AMD Ryzen AI Embedded xxxxx with 10 cores 2.0GHz up to 5.0GHz (boost) Integrated XDNA2 NPU Integrated RDNA 3.5 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial te
COM Express Compact AMD PTT-365 24 MB