INT 模块化计算机 - COM

结果: 813
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 外观尺寸 处理器品牌 处理器类型 芯片组 频率 RAM最大容量 已安装RAM 高速缓冲存储器 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸
congatec 模块化计算机 - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera
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COM Express Basic Type 7 Intel Integrated SoC 1.6 GHz 4 MB PCIe 0 C + 60 C 95 mm x 125 mm
congatec conga-TC700/ultra7-155H
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on Intel Core Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores P-cores 1.4Ghz up to 4.8GHz (turbo) E-Cores 0.9GHz up to 3.8GHz (turbo) Low Power E-cores up to 2.5GHz (turbo) Integra
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congatec 模块化计算机 - COM COM HPC Size A module with Intel Core i7-1185GRE Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.
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COM-HPC Size A Intel Core i7-1185GRE 1.8 GHz to 4.4 GHz 12 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 95 mm x 120 mm
congatec 模块化计算机 - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.
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COM-HPC Size A Intel Core i3-1115GRE 2.2 GHz to 3.9 GHz 6 MB Audio, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 95 mm x 120 mm
DFRobot 模块化计算机 - COM LattePanda Mu Ultra - A Micro x86 Compute Module for On-device AI (Intel Core Ultra 7 256V CPU, 16GB RAM, 115 TOPS)
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Micro x86 Compute Module Intel Intel Core Ultra 7 256V 4.8 GHz 16 GB 12 MB 9 VDC to 20 VDC DisplayPort, GPIO, HDMI, I2C, PCIe, UART, USB 0 C + 60 C 60 mm x 69.6 mm
congatec 模块化计算机 - COM COM Express Type 7 Basic module based on AMD embedded EPYC 3255 8-core processor (single die) with 2.5GHz up to 3.1 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl).
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COM Express Type 7 AMD EPYC 3255 Integrated SoC 3.1 GHz 16 MB SPI, UART, USB - 40 C + 85 C 125 mm x 95 mm
congatec 模块化计算机 - COM COM Express Compact module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.
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COM Express Type 6 Intel Atom x5-E3940 Integrated SoC 1.6 GHz 8 GB 2 MB 2 MB - 40 C + 85 C 95 mm x 95 mm
congatec 模块化计算机 - COM Qseven 2.0 module based on Intel Atom x7 E3950 SoC (Itemp Quad-core, 12W TDP, CPU freq. 1.6/2.0GHz, GPU 18EU freq. 500/650MHz) with on-board memory 8GB DDR3L-1866 and 32GB eMMC.
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Qseven Intel Atom x7-E3950 Integrated SoC 1.6 GHz 42 MB 2 MB 2 MB - 40 C + 85 C 70 mm x 70 mm
congatec 模块化计算机 - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor
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COM-HPC Mini Intel Core i7-1365URE 1.2 GHz, 1.7 GHz 64 GB 32 GB 12 MB DP, DP++, Ethernet, GPIO, PCIe Gen3/4, SATA III, SPI, UART, USB 2.0, USB 3.2, USB 4.0 + 85 C 95 mm x 70 mm
congatec 模块化计算机 - COM COM Express Mini Type10 module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz 2MB L2 cache 4GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.
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COM Express Mini Type 10 Intel Atom x5-E3940 Integrated SoC 1.6 GHz 22 MB 22 MB 2 MB - 40 C + 85 C 55 mm x 84 mm
ADLINK Technology LEC-ALN-N97-8G-64G-CT
ADLINK Technology 模块化计算机 - COM SMARC 2.1 COM with Intel Alder Lake N97 Quad Core CPU, 8GB LPDDR5, 64GB eMMC, commercial temp
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SMARC v2.1 Intel N97 1.5 GHz 16 GB 8 GB 6 MB 5 V Audio, CAN, Ethernet, GPIO, I2C, LVDS, MIPI-CSI, PCIe, SATA III, SPI, UART, USB 2.0, USB 3.2 0 C + 60 C 82 mm x 50 mm
congatec conga-TCR8/8645HS
congatec 模块化计算机 - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded 8645HS with 6 cores 4.3GHz up to 5.0GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 22MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial temp
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congatec 模块化计算机 - COM Qseven module with Intel Atom x6212RE dual core processor with 1.2GHz core frequency, 1.5MB cache, 4GB 3.200MT/s LPDDR4x onboard memory and 32GB eMMC 5.1 onboard flash. Industrial grade temperature range from -40 C to 85 C.
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Qseven Form Factor, Qseven Spec. Rev. 2.1 Intel Atom x6212RE 1.2 GHz 1.5 MB Audio, CAN, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB - 40 C + 85 C 70 mm x 70 mm
congatec 模块化计算机 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran
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SMARC v2.0 NXP 0 C + 60 C 82 mm x 50 mm
congatec 模块化计算机 - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr
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COM Express Type 6 AMD Integrated SoC 3.5 GHz 1 MB PCIe 0 C + 60 C 95 mm x 125 mm
IEI 模块化计算机 - COM Qseven Rev. 2.1 module with Intel N-series N97 SoC Processor(12W), with 8GB LPDDR5 memory on board default, Support HDMI, LVDS, 2.5GbE, SATA 6Gb/s, USB 3.2, Audio and RoHS
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IEI 模块化计算机 - COM Qseven Rev. 2.1 module with Intel Atom x7433RE SoC Processor (9W), with 8GB LPDDR5 memory on board default, Support HDMI, LVDS, 2.5GbE, SATA 6Gb/s, USB 3.2,Audio and RoHS
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IEI 模块化计算机 - COM Qseven Rev. 2.1 module with Intel x7211E SoC Processor (6W), with 8GB LPDDR5 memory on board default, Support HDMI, LVDS, 2.5GbE, SATA 6Gb/s, USB 3.2, Audio and RoHS
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congatec 模块化计算机 - COM COM-HPC Size D module based on Intel Xeon D1735TR 8-core processor with tbd GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.
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COM-HPC Intel Xeon D-2733NT Integrated SoC 2.1 GHz 1 TB 15 MB Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 60 C 200 mm x 160 mm
congatec 模块化计算机 - COM COM-HPC Size D module based on Intel Xeon D1732TE 8-core processor with 1.9 GHz, 15MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range.
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COM-HPC Intel Xeon D1732TE Integrated SoC 1.9 GHz 256 GB 15 MB Ethernet, I2C, PCle, Serial, USB - 40 C + 85 C 160 mm x 160 mm
JUMPtec 模块化计算机 - COM JUMPtec COMh-caRP E2 i3-13300HRE
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Intel 2.1 GHz 12 MB 8 V to 20 V Serial - 40 C + 85 C 120 mm x 95 mm
Axiomtek 模块化计算机 - COM COM Express Type 6 Compact module with Intel Atom x6425RE, DDI, LVDS, 3.2 Gen1, GbE LAN, and wide t
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JUMPtec 模块化计算机 - COM JUMPtec COMh-caRP E2 i7-13800HRE
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Intel 2.5 GHz 24 MB 8 V to 20 V Serial - 40 C + 85 C 120 mm x 95 mm
JUMPtec 模块化计算机 - COM COMe-bTL6 i3-11100HE RM590E
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COM Express Basic Type 6 Intel Core i3-11100HE RM590E 2.4 GHz 8 MB 8.5 V to 20 V I2C, SPI, UART 0 C + 60 C 125 mm x 95 mm
congatec 模块化计算机 - COM COM Express Type 6 Compact module with Intel Pentium J6426 quad core processor with 2.0GHz core frequency up to 3.0GHz, 1.5MB cache and up to 32GB 3200MT/s DDR4 SODIMM memory support.
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COM Express Compact Intel Celeron J6426 2 GHz to 3 GHz 1.5 MB Audio, CAN, Ethernet, GPIO, I2C, PCIe, SATA, UART, USB 0 C + 60 C 95 mm x 95 mm