模块化系统 - SOM

结果: 267
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Trenz Electronic 模块化系统 - SOM SoC Module with Altera Agilex 5E, 2 GB LPDDR4 SDRAM, 5.2 x 7.6 cm

QSPI 0 C + 85 C Bulk
Lantronix 模块化系统 - SOM Production ready computing module, based on Qualcomm QCS8250 processor.

Bulk
Luxonis 模块化系统 - SOM OAK-SoM-MAX-1 (4x 2-lane MIPI)

OAK-SoM RVC3 4 GB 4 GB 5 V I2C, I2S, MIPI-CSI-2, PCIe, RGMII, SDIO, UART, USB 3.1 + 50 C 40 mm x 40 mm x 28.3 mm Bulk
Luxonis 模块化系统 - SOM OAK-SoM-Pro (5pcs box)

Bulk
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C

STMicroelectronics STM32MP157F 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0 C to 85 C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40 C to 100 C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 100 C 20.5 mm X 40 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40 C to 85 C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40 C to 85 C

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Lantronix 模块化系统 - SOM Open-Q? 7230CS SOM (6GB/64GB) production ready computing module, based on Qualcomm QCS7230 processor.
Bulk
Lantronix 模块化系统 - SOM Production ready computing module, based on Qualcomm QCS7230 processor.
Bulk
BECOM Systems 模块化系统 - SOM eCM-BF561-C-I-Q25S128F32

Blackfin ADI ADSP-BF561 1.2 GHz 128 MB 0 GB 3 V to 3.6 V - 40 C + 85 C 44 mm x 33 mm x 3.5 mm Bulk
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 2GB / 16GB eMMC / LWB5+ / Industrial Temp

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 4GB / 16GB eMMC / LWB5+ / Industrial Temp

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Ezurio 模块化系统 - SOM Nitrogen8M PLUS SMARC: i.MX8M Quad Plus / 8GB / 16GB eMMC / LWB5+

NXP i.MX 8M Plus 1.8 GHz 5 V I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Ezurio 模块化系统 - SOM Nitrogen93 SMARC SOM: i.MX 93 Dual / 1GB / 16GB eMMC / 0 to +70 C

SMARC 2.1.1 i.MX 93 1.7 GHz 4 GB 1 GB 5 V CAN, GPIO, I2C, SPI, UART, USB 0 C + 70 C 82 mm x 50 mm Tray
iWave Global 模块化系统 - SOM i.MX 8M Plus Quad OSM SOM with 2GB LPDDR4, 16GB eMMC, 802.11ac Wi-Fi + BLE 5.0

iG-G40M 45 mm x 45 mm NXP i.MX 8M Plus Quad 2 GHz 8 GB 2 GB 4.75 V to 5.25 V CAN FD, Bluetooth, GPIO, HDMI, I2C, LVDS, MIPI-DSI, PCIe, RGMII, SAI/I2S, SDIO, SPI, UART, USB 2.0, USB 3.0, WiFi - 40 C + 85 C 45 mm x 45 mm x 1.2 mm Bulk
iWave Global 模块化系统 - SOM i.MX 9131 (A0 CPU) OSM SOM with 2GB LPDDR4, 16GB eMMC, 802.11ac/ax Wi-Fi + BLE 5.x, Industrial Grade

iG-G50M 5 V I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm Bulk
iWave Global 模块化系统 - SOM i.MX 9131 (A0 CPU) SMARC SOM with 2GB LPDDR4, 16GB eMMC, 802.11ac/ax Wi-Fi + BLE 5.x, Industrial

iG-G50M 5 V I2C, SPI, UART - 40 C + 85 C 82 mm x 50 mm Bulk
iWave Global 模块化系统 - SOM RZ/V2L SMARC Dev.Kit with 2GB LPDDR4, 16GB eMMC

iG-G56D ARM Cortex-A55 1.2 GHz UART 82 mm x 50 mm Bulk
iWave Global 模块化系统 - SOM RZ/V2L SMARC SOM with 2GB LPDDR4, 16GB eMMC, Industrial

iG-G56M ARM Cortex-A55 1.2 GHz UART 82 mm x 50 mm Bulk
NetBurner 模块化系统 - SOM

MOD54415 Ethernet, I2C, SPI, UART - 40 C + 85 C Bulk
Octavo Systems 模块化系统 - SOM AM3358 512MB DDR3 System-In-Package

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 27 mm x 27 mm Tray