CA 模块化系统 - SOM

结果: 1,036
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 外观尺寸 处理器品牌 处理器类型 频率 RAM最大容量 已安装RAM 工作电源电压 接口类型 最小工作温度 最大工作温度 尺寸 封装
Raspberry Pi 模块化系统 - SOM CM5116000 (Compute Module CM5, 16GB RAM/0GB eMMC, Wireless)
249预期 2027/1/4
¥2,812.344
最低: 1
倍数: 1
最大: 100
Bulk
Raspberry Pi 模块化系统 - SOM CM5116016 (Compute Module CM5, 16GB RAM/16GB eMMC, Wireless)
249预期 2027/1/11
¥3,019.134
最低: 1
倍数: 1
最大: 100
Bulk
Raspberry Pi 模块化系统 - SOM CM5116064 (Compute Module CM5, 16GB RAM/64GB eMMC, Wireless)
240预期 2026/12/21
¥3,101.85
最低: 1
倍数: 1
最大: 100
Bulk
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
332在途量
¥569.9155
最低: 1
倍数: 1
OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB 0 C + 85 C 18 mm x 18 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
316预期 2027/4/9
¥583.5659
最低: 1
倍数: 1
OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB - 40 C + 85 C 18 mm x 18 mm Tray
Octavo Systems 模块化系统 - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
160预期 2026/11/5
¥1,009.6324
最低: 1
倍数: 1
Texas Instruments AM3358 1 GHz 1 GB 1 GB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Octavo Systems 模块化系统 - SOM AM3358 512MB DDR3 System-In-Package
264预期 2026/11/23
¥500.8499
最低: 1
倍数: 1
OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 21 mm x 21 mm Tray
ReFLEX CES 模块化系统 - SOM Module "Indus" v5 version, new
73在途量
¥24,684.5223
最低: 1
倍数: 1
Arria 10 SoC I2C, SPI, UART 95 mm x 83.1 mm
Microchip Technology 模块化系统 - SOM SAMA5D2 SYST.ON MODULE 1
1,344预期 2027/1/25
¥275.6974
最低: 1
倍数: 1
SAMA5D27 Microchip Technology SAMA5D27 500 MHz 128 MB 128 MB 3.3 V CAN, Ethernet, I2S, QSPI, SPI, SSC, TWI, UART, USB - 40 C + 85 C 40 mm x 38 mm Tray
Ezurio 模块化系统 - SOM Nitrogen6 System on Module: i.MX6 Quad / 2GB / 4GB eMMC
82预期 2027/5/5
¥1,565.5924
最低: 1
倍数: 1
2 GB 2 GB
krtkl 模块化系统 - SOM Snickerdoodle Black, connectors down. Features Zynq-7000 (XC7Z020-3), 866MHz Dual-Core ARM Cortex-A9, Artix 7 FGPA, 1GB LPDDR2, Dual-Band MIMO Wi-Fi, 180 I/O (125 FPGA, 55 additional), SD cardcage, copper heat sink, connector configuration: down
215在途量
¥2,627.9619
最低: 1
倍数: 1
snickerdoodle Xilinx XC7Z020-3CLG400E 866 MHz 1 GB 1 GB 3.7 V to 17 V Audio, CAN, Ethernet, GPIO, I2C, I2S, SPI, UART, USB 2.0, WiFi 0 C + 85 C 88.9 mm x 50.8 mm
NetBurner 模块化系统 - SOM 32-Bit 147MHz 10 Pin Header Ind Temp
13预期 2026/10/16
¥1,358.6216
最低: 1
倍数: 1
ColdFire 5270 Ethernet 0 C + 70 C 2.6 in x 2 in
Digi 模块化系统 - SOM ConnectCore MP255 STM32MP255C, Dual A35 1.2GHz, M33, GPU, ISP, NPU, 8GB eMMC, 1GB DDR4, -40/+85C
71预期 2026/11/16
¥1,364.8931
最低: 1
倍数: 1
ConnectCore MP2 30 mm x 30 mm 1.5 GHz I2C, SPI, UART - 40 C + 85 C 30 mm x 30 mm x 3 mm
Digi 模块化系统 - SOM ConnectCore 93 Dual, i.MX 93 Dual A55, M33, NPU, 1GB LPDDR4, 8GB eMMC, -40/+85C, Wi-Fi 802.11ax, Bluetooth 5.3
50预期 2026/11/3
¥1,517.1719
最低: 1
倍数: 1
ConnectCore 93 - 40 C + 85 C 45 mm x 40 mm
NetBurner 模块化系统 - SOM Ethernet Core Module 100 VER. 2X W/ RJ-4 交货期 15 周
¥1,206.7157
最低: 1
倍数: 1
ColdFire 54417 Ethernet, I2C, SPI, UART - 40 C + 85 C 2.95 in x 2 in Bulk
Trenz Electronic 模块化系统 - SOM High IO FPGA Module with AMD Artix 7A100T-2C, USB, 4 x 5 cm
14预期 2027/3/5
¥1,687.4064
最低: 1
倍数: 1
4 cm x 5 cm AMD XC7A100T-2CSG324C 0 GB 0 GB 3.3 V, 5 V 0 C + 70 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM FPGA-Modul with AMD Artix 7A100T-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
6预期 2027/1/13
¥2,597.2824
最低: 1
倍数: 1
4 cm x 5 mm Xilinx XC7A100T-1FGG484I 3.3 V, 5 V Ethernet, JTAG, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM SoC Module with AMD Zynq 7015-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
4预期 2027/4/20
¥3,135.6031
最低: 1
倍数: 1
Xilinx XC7Z015-1CLG485I 125 MHz Ethernet, I2C, SPI, USB 2.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 模块化系统 - SOM SoC Module with AMD Zynq 7030-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
15在途量
¥4,665.1824
最低: 1
倍数: 1
Xilinx XC7Z030-1SBG485I 125 MHz Ethernet, I2C, SPI, USB 2.0 - 40 C + 85 C 50 mm x 40 mm

Trenz Electronic 模块化系统 - SOM Micromodule with AMD Kintex UltraScale KU040, 2 GByte DDR4, 4 x 5 cm
3预期 2027/3/29
¥18,734.8463
最低: 1
倍数: 1
Trenz Electronic 模块化系统 - SOM MAX1000 - IoT Maker Board, 8kLE, 8 MByte SDRAM, 8 MByte Flash, 6.15 x 2.5 cm
98在途量
¥363.9504
最低: 1
倍数: 1
Altera, Intel 5 V 0 C + 85 C 6.15 cm x 2.5 cm
Raspberry Pi 模块化系统 - SOM Compute Module CM3+/Lite
201预期 2026/10/23
¥206.79
最低: 1
倍数: 1
Raspberry Pi CM3 Broadcom BCM2837B0 1.2 GHz 1 GB 1.8 V, 3.3 V CSI, DSI, GPIO, HDMI, I2C, SPI, UART, USB - 25 C + 80 C 67.6 mm x 31 mm
Raspberry Pi 模块化系统 - SOM CM4001016 - Compute Module 4 Rev5
9预期 2026/10/29
¥547.9935
最低: 1
倍数: 1
Raspberry Pi CM4 Raspberry Pi Compute Module 4 Broadcom BCM2711 1.5 GHz 8 GB 1 GB 5 V CSI, DPI, DSI, Ethernet, GPIO, HDMI, I2C, MIPI-CSI-2, MIPI-DSI, PCIe, PCM, SDIO, SPI, UART, USB 2.0 - 20 C + 85 C 55 mm x 40 mm x 4.7 mm
Octavo Systems 模块化系统 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40 C to 100 C
8预期 2027/3/30
¥7,836.6743
最低: 1
倍数: 1
OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 100 C 20.5 mm X 40 mm Tray
Particle 模块化系统 - SOM B Series LTE CAT-M1 (NorAm, EtherSIM), [x1]
100预期 2026/10/21
¥454.5199
最低: 1
倍数: 1
Nordic, u-blox nRF52840 64 MHz, 700 MHz, 750 MHz, 800 MHz, 850 MHz, 900 MHz, 1.7 GHz, 1.9 GHz, 2.4 GHz 256 kB 256 kB 3.6 V to 4.2 V Bluetooth, GPIO, I2C, JTAG, PWM, SPI, UART, USB 2.0 - 20 C + 65 C 42 mm x 30 mm x 5.5 mm