08EP08-N3GTC32-GA67

Kingston
524-N3GTC32-GA67
08EP08-N3GTC32-GA67

制造商：

说明：
多芯片封装 8GB+8Gb 136 ball ePoP

数据表:
ECAD模型:
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了解Kingston 08EP08-N3GTC32-GA67详情

供货情况

库存：
无库存
生产周期：
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥278.4207 ¥278.42

产品属性 属性值 选择属性
Kingston
产品种类: 多芯片封装
RoHS:  
8 Gbit, 8 Gbit
FBGA-136
SMD/SMT
- 25 C
+ 85 C
商标: Kingston
接口类型: eMMC 5.1
湿度敏感性: Yes
封装: Tray
产品类型: Multichip Packages
工厂包装数量: 15
子类别: Memory & Data Storage
单位重量: 162 mg
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已选择的属性: 0

数据表

合规代码
CNHTS:
8542329090
CAHTS:
8542320040
USHTS:
8542320051
MXHTS:
8542320299
ECCN:
EAR99
原产地分类
原产国:
中国台湾
组装原产国/地区:
不可用
扩散国家:
不可用
发货时，国家/地区可能会发生变化。

Embedded Flash

Kingston Technology Embedded Flash is an embedded, non-volatile memory system consisting of both Flash memory and a Flash memory controller. The Embedded Flash products simplify the application interface design and frees the host processor from low-level Flash memory management. The modules are ideal for industrial and embedded applications, including consumer electronics. Kingston Technology Embedded Flash offers a quick interface design and qualification process, reducing time to market and supporting future Flash device offerings. The I-Temp Flash memory provides JEDEC eMMC5.1 features and is backward compatible with earlier eMMC standards. It has all the benefits of standard Flash, plus the operating temperature range meets industrial temperature requirements of -40°C to +85°C, ideal for outdoor surveillance, factory automation, transportation, and other applications in fluid environmental conditions.

ePOP & eMCP Multi-Chip Package Memory Devices

Kingston ePOP and eMCP Multi-Chip Package Memory Devices combine e.MMC™storage (JESD84-B51) and low power DDR4X(JESD209-4-1)/DDR3 (JESD209-3B) Synchronous Dynamic RAM. The e.MMC™ part is an embedded flash memory storage solution with an e.MMC™ interface. The e.MMC™ controller directly manages NAND flash, including wear-leveling, end-to-end error control, IOPS optimization, and read sensing. These devices are available in an 8mm x 9.5mm or 10mm x 10mm package. The ePOP and eMCP devices are used in mobile communications applications.

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