ARM Cortex M33 核心 无线与射频模块

无线和射频模块类型
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS 产品类型
产品
频率
接口类型
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
Nordic Semiconductor 多协议模块 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
数据表
2,500预期 2026/12/25
最低： 1
倍数： 1
: 2,500

Multiprotocol Modules DECT NR+, GPS, LTE CatM1/NB1/NB2, QZSS 700 MHz to 2.2 GHz I2C, I2S, SPI, UART DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS
Silicon Labs 多协议模块 Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
数据表
1,000在途量
最低： 1
倍数： 1

Multiprotocol Modules Bluetooth Modules 2.4 GHz I2C, USART Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee)
Silicon Labs 多协议模块 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
数据表
800预期 2026/11/6
最低： 1
倍数： 1

Multiprotocol Modules Bluetooth Modules 2.4 GHz I2C, USART Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee)
Silicon Labs 多协议模块 MGM220P wireless gecko
数据表
188预期 2026/9/18
最低： 1
倍数： 1

Multiprotocol Modules Bluetooth 5.4, Bluetooth Mesh, Zigbee 2.4 GHz Bluetooth, GPIO, I2C, UART Bluetooth 5.2, Bluetooth Mesh Zigbee
Silicon Labs 蓝牙模块 - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
数据表
无库存交货期 41 周
最低： 1
倍数： 1

Bluetooth Modules 2.44 GHz I2C, SPI, UART Bluetooth LE
Silicon Labs 蓝牙模块 - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
数据表
无库存交货期 41 周
最低： 1,000
倍数： 1,000
: 1,000

Bluetooth Modules 2.44 GHz I2C Bluetooth LE
Silicon Labs 多协议模块 MGM220P wireless gecko
数据表
无库存交货期 20 周
最低： 1,000
倍数： 1,000
: 1,000

Multiprotocol Modules Bluetooth 5.4, Bluetooth Mesh, Zigbee 2.4 GHz Bluetooth, GPIO, I2C, UART Bluetooth 5.2, Bluetooth Mesh Zigbee
Infineon Technologies 蓝牙模块 - 802.15.1 BTBLE IOT BLE
数据表

Bluetooth Modules Bluetooth Modules 2.4 GHz GPIO, I2C, I2S, SPI, UART Bluetooth LE
Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas
数据表

Multiprotocol Modules 802.11 a/b/g/n/ac/ax, 802.15.4, BLE 2.4 GHz, 5 GHz GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 BLE 802.11 a/b/g/n/ac/ax 802.15.4
Quectel 蓝牙模块 - 802.15.1

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1
Bluetooth Modules 2.4 GHz UART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1 BT 5.4 & BLE Mesh, 20 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna
数据表

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna
数据表

Bluetooth Modules 2.4 GHz ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna
数据表
Bluetooth Modules Bluetooth Modules I2C, USART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, RF antenna connector
数据表
Bluetooth Modules Bluetooth Modules I2C, USART Bluetooth LE
Quectel 蓝牙模块 - 802.15.1 BLE 5.4 standalone module w/ chip antenna in LGA FF, 32 KB RAM, 512 KB flash, 18 GPIOs, transmit power = 8 dBm, -40 C to +85 C
数据表
Bluetooth Modules Bluetooth Modules I2C, SPI, USART Bluetooth LE