Bluetooth Connectivity (802.15.1)

Bluetooth is used for IoT nodes that are not directly connected to the internet and so do not require an IP address. Bluetooth is good for medium data rate applications that need to transmit data over short distances.

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结果: 446
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 协议 接口类型 输出功率 数据速率 接收器灵敏度 频率 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 封装
Silicon Labs 蓝牙模块 - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna
6,000预期 2026/12/25
最低: 1
倍数: 1
: 1,000

BGM13P BLE, Bluetooth 5.0 I2C, UART, USART 8 dBm 2 Mb/s,kb/s,Mb/s - 94.8 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Silicon Labs 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna
3,174在途量
最低: 1
倍数: 1

BGM13S BLE, Bluetooth 5.0 I2C, UART 18 dBm 2 Mb/s,kb/s,Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna/RF Pin, 24 GPIO, 105C
15,000预期 2026/12/4
最低: 1
倍数: 1
: 2,500

BLE, Bluetooth 5.4 I2C, SPI, UART 6 dBm 2 Mb/s,kb/s,Mb/s - 98.6 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 105 C Reel, Cut Tape, MouseReel
Silicon Labs 蓝牙模块 - 802.15.1 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
17,537在途量
最低: 1
倍数: 1

xGM240S BLE, Bluetooth 5.3 2.4 GHz Tray
Silicon Labs 蓝牙模块 - 802.15.1 BT122 Dual Mode Buetooth LE, BR/EDR, EFM32 Series 1 MCU, 256 K Flash, Internal Antenna
4,980在途量
最低: 1
倍数: 1

IoT Bluetooth 4.2 Class 2 I2C, UART 11 dBm 3 Mb/s,kb/s,Mb/s - 95 dBm 2.44 GHz 2.2 V 3.6 V - 40 C + 85 C Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BT122 Dual Mode Buetooth LE, BR/EDR, EFM32 Series 1 MCU, 256 K Flash, Internal Antenna
28,678在途量
最低: 1
倍数: 1
: 1,000

IoT Bluetooth 4.2 Class 2 I2C, UART 11 dBm 3 Mb/s,kb/s,Mb/s - 95 dBm 2.44 GHz 2.2 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Panasonic Industry 蓝牙模块 - 802.15.1 PAN1780 BT LE RF Module (Nordic Semiconductor nRF52840)
2,500在途量
最低: 1
倍数: 1
: 500

PAN1780 BLE, Bluetooth 5.0 UART 8 dBm - 103 dBm 2.48 GHz 1.7 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Renesas / Dialog 蓝牙模块 - 802.15.1 Bluetooth Low Energy 5.1 Module with integrated ARM Cortex M0+, memories and peripherals ? 8 GPIOs
20,999在途量
最低: 1
倍数: 1
: 1,000

DA14531 Bluetooth 5.1 Class 2 I2C, SPI, UART 2.2 dBm 2 Mb/s,kb/s,Mb/s - 93 dBm 2.44 GHz 1.8 V 3.3 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Renesas / Dialog 蓝牙模块 - 802.15.1 Multi-Core BLE 5.2 SoC with Embedded FLASH
5,500预期 2027/3/16
最低: 1
倍数: 1
: 5,500

DA14592 Reel, Cut Tape
Infineon Technologies 蓝牙模块 - 802.15.1 EZ-BLE PRoC Blue tooth 4.2 Module
3,500在途量
最低: 1
倍数: 1
: 500

BLE, Bluetooth 4.2 I2C, SPI, UART 3 dBm 1 Mb/s,kb/s,Mb/s - 87 dBm 2.44 GHz 1.71 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Infineon Technologies 蓝牙模块 - 802.15.1 BTBLE IOT BLE
5,500在途量
最低: 1
倍数: 1
: 500

BLE, Bluetooth 4.2 Serial 3 dBm 1 Mb/s,kb/s,Mb/s - 87 dBm 2.45 GHz 1.9 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Microchip Technology 蓝牙模块 - 802.15.1 Class 2.1 Bluetooth Module w/ Antenna
5,854预期 2027/1/25
最低: 1
倍数: 1

RN42 Bluetooth 2.1 + EDR Class 2 SPI, UART 2 dBm 3 Mb/s,kb/s,Mb/s - 80 dBm 2.4 GHz 3.3 V 3.3 V - 40 C + 85 C Tray
Ezurio 蓝牙模块 - 802.15.1 Intelligent USB BTv4.0 Dongle, Module
50预期 2026/10/7
最低: 1
倍数: 1

BT900 BLE, Bluetooth 4.0 GPIO, I2C, SPI, UART 8 dBm 3 Mb/s,kb/s,Mb/s - 90 dBm 2.44 GHz 5 V 5 V - 40 C + 85 C Bulk
Insight SiP 蓝牙模块 - 802.15.1 ISP1807-LR BT5 NFC flash 1M ram 256K - Jedec Tray
166在途量
最低: 1
倍数: 1

ISP1807 BLE, Bluetooth 5.0 8 dBm 2 Mb/s,kb/s,Mb/s - 95 dBm 2.43 GHz 1.7 V 5.5 V - 40 C + 85 C Tray
Wurth Elektronik 蓝牙模块 - 802.15.1 WIRL-BTLE Proteus-e Bluetooth 5.1 module
500预期 2026/9/15
最低: 1
倍数: 1
: 500

WIRL-BTLE BLE UART 4 dBm 2 Mb/s,kb/s,Mb/s - 93 dBm 2.4 GHz 1.8 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
u-blox 蓝牙模块 - 802.15.1 nRF52832, SIP, chip antenna, antenna pin, u-cX / openCPU
1,500预期 2027/5/31
最低: 1
倍数: 1
: 500

BLE, Bluetooth 5.0 I2C, I2S, SPI, UART 4 dBm 2 Mb/s,kb/s,Mb/s - 91 dBm 2.4 GHz 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
u-blox 蓝牙模块 - 802.15.1 nRF52832, antenna pin, u-connectXpress / open CPU
2,488在途量
最低: 1
倍数: 1
: 500

BLE, Bluetooth 5.0 GPIO, I2C, SPI, UART, USB 7 dBm 1 Mb/s,kb/s,Mb/s, 2 Mb/s,kb/s,Mb/s - 95 dBm 2.4 GHz 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape
u-blox 蓝牙模块 - 802.15.1 nRF52833, antenna pin, u-connectXpress
994预期 2026/11/13
最低: 1
倍数: 1
: 500

NINA-B41 Bluetooth 5.1 GPIO, I2C, SPI, UART, USB 8 dBm 2 Mb/s,kb/s,Mb/s - 95 dBm, - 102 dBm 2.4 GHz 1.7 V 3.6 V - 40 C + 105 C Reel, Cut Tape
STMicroelectronics 蓝牙模块 - 802.15.1 Very low power network processor module for Bluetooth® low energy v4.2
1,994预期 2026/10/12
最低: 1
倍数: 1
: 1,000

BLUENRG-M0 BLE, Bluetooth 4.2 SPI 6 dBm - 88 dBm 2.402 GHz to 2.48 GHz 1.7 V 3.6 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Silicon Labs 蓝牙模块 - 802.15.1 BGM111A Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna
400预期 2027/1/22
最低: 1
倍数: 1

BGM111 BLE, Bluetooth 4.1 Serial 8 dBm 1 Mb/s,kb/s,Mb/s - 92 dBm 2.4 GHz 1.85 V 3.8 V - 40 C + 85 C Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM11S Wireless Bluetooth Module, SiP, +2 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna
2,000在途量
最低: 1
倍数: 1
: 1,000

BGM11S BLE, Bluetooth 4.2 I2C, UART, USART 3 dBm 1 Mb/s,kb/s,Mb/s - 90 dBm 2.4 GHz 1.85 V 3.8 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Silicon Labs 蓝牙模块 - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector
1,100在途量
最低: 1
倍数: 1

BGM13P BLE, Bluetooth 5.0 I2C, UART, USART 19 dBm 1 Mb/s,kb/s,Mb/s - 94.8 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 85 C Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna
1,850在途量
最低: 1
倍数: 1
: 1,000

BGM13S BLE, Bluetooth 5.0 I2C, UART 8 dBm 2 Mb/s,kb/s,Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +8 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna
1,885在途量
最低: 1
倍数: 1

BGM13S BLE, Bluetooth 5.0 I2C, UART 8 dBm 2 Mb/s,kb/s,Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 BGM13S Wireless Bluetooth Module, SiP, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, Built-in Antenna
1,000在途量
最低: 1
倍数: 1
: 1,000

BGM13S BLE, Bluetooth 5.0 I2C, UART 18 dBm 2 Mb/s,kb/s,Mb/s - 90.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Reel, Cut Tape, MouseReel