15 mm 蓝牙模块 - 802.15.1

结果: 66
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数量 RoHS ECAD模型 系列
协议
类
接口类型
输出功率
数据速率
接收器灵敏度
频率
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
封装
u-blox 蓝牙模块 - 802.15.1
数据表
无库存交货期 20 周
最低： 500
倍数： 500

NINA-B41 Bluetooth 5.1 GPIO, I2C, SPI, UART, USB 8 dBm 2 Mb/s,kb/s,Mb/s - 95 dBm, - 102 dBm 2.4 GHz 1.7 V 3.6 V - 40 C + 105 C
Silicon Labs 蓝牙模块 - 802.15.1
数据表
无库存
最低： 1,000
倍数： 1,000
: 1,000

BGM111 BLE, Bluetooth 4.1 Serial 8 dBm 1 Mb/s,kb/s,Mb/s - 92 dBm 2.4 GHz 1.85 V 3.8 V - 40 C + 85 C Reel
Silicon Labs 蓝牙模块 - 802.15.1 BGM13P Wireless Bluetooth Module, PCB, +19 dBm, 2.4 GHz, 512 kB flash, -40 to 85 C, U.FL Connector
数据表
无库存交货期 52 周
最低： 1
倍数： 1
: 1,000

BGM13P BLE, Bluetooth 5.0 I2C, UART, USART 19 dBm 1 Mb/s,kb/s,Mb/s - 94.8 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
数据表
无库存交货期 41 周
最低： 1
倍数： 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 10 dBm 2 Mb/s,kb/s,Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
数据表
无库存交货期 41 周
最低： 1,000
倍数： 1,000
: 1,000

BLE, Bluetooth 5.1 Class 2 I2C 10 dBm 2 Mb/s,kb/s,Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Reel
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth BLE Module, Unshielded, No Antenna, 12x15mm, Industrial Temp
数据表
无库存交货期 20 周
最低： 136
倍数： 136

BM70 BLE, Bluetooth 5.0 I2C, SPI, UART 0 dBm - 90 dBm 2.44 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth BLE Module, Unshielded, No Antenna, 12x15mm, Industrial Temp
数据表
无库存交货期 20 周
最低： 1
倍数： 1

BM70 BLE, Bluetooth 5.0 Serial 0 dBm - 90 dBm 2.44 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth BLE Module, Shielded, Antenna, 12x22mm, Industrial Temp
数据表
无库存交货期 20 周
最低： 1
倍数： 1

BM70 BLE, Bluetooth 5.0 Serial 0 dBm - 90 dBm 2.44 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 BGM111E Wireless Bluetooth Module, PCB, +8 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, U.FL Connector
数据表
无库存
最低： 1
倍数： 1

BGM111 BLE, Bluetooth 4.2 GPIO, I2C, SPI, UART 8 dBm 1 Mb/s,kb/s,Mb/s - 92 dBm 2.44 GHz 1.85 V 3.8 V - 40 C + 85 C Cut Tape
u-blox 蓝牙模块 - 802.15.1 Bluetooth Low Energy stand-alone module,embedded PCB trace antenna, Open CPU
数据表

I2C, SPI, UART 10 dBm 2 Mb/s,kb/s,Mb/s - 94 dBm 2.402 GHz to 2.48 GHz 1.71 V 3.6 V - 40 C + 85 C Reel, Cut Tape
Quectel 蓝牙模块 - 802.15.1 BT 5.0,Bluetooth independent antenna
数据表
Bluetooth 5.0 UART - 92 dBm, - 90 dBm, - 85 dBm, - 95 dBm 3.13 V 3.46 V - 40 C + 105 C Reel
Quectel 蓝牙模块 - 802.15.1 BT 5.0,Bluetooth independent antenna
数据表
Bluetooth 5.0 UART - 92 dBm, - 90 dBm, - 85 dBm, - 95 dBm 3.13 V 3.46 V - 40 C + 105 C Reel
Quectel 蓝牙模块 - 802.15.1 BT 5.0,Bluetooth independent antenna
数据表
Bluetooth 5.0 UART - 92 dBm, - 90 dBm, - 85 dBm, - 95 dBm 3.13 V 3.46 V - 40 C + 105 C Reel
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, LCC pin antenna, No audio codec for mic in/out
数据表
BLE 5.3 I2C, SPI, UART - 95 dBm, - 90 dBm 1.8 V 4.3 V - 40 C + 85 C Reel
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, PCB antenna, No audio codec for mic in/out
数据表
BLE 5.3 I2C, SPI, UART - 95 dBm, - 90 dBm 1.8 V 4.3 V - 40 C + 85 C Reel, Cut Tape
Quectel 蓝牙模块 - 802.15.1 BLE 5.3 standalone module, IPEX-4 antenna connector, , No audio codec for mic in/out
数据表
BLE 5.3 I2C, SPI, UART - 95 dBm, - 90 dBm 1.8 V 4.3 V - 40 C + 85 C Reel