结果: 222
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数量 RoHS ECAD模型 系列
协议
类
接口类型
输出功率
数据速率
接收器灵敏度
频率
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
封装
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna
数据表

ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 11 dBm 2 Mb/s,kb/s,Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with u.FL Antenna
数据表

ADC, DAC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 11 dBm 2 Mb/s,kb/s,Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth 5 Dual Mode with Shield, Antenna Module with ASCII Interface and MFI support FW 1.13
数据表
直接发货交货期 17 周
最低： 88
倍数： 88

RN4678 BLE, Bluetooth 5.0, BR/EDR Class 2 UART 1.5 dBm 1 Mb/s,kb/s,Mb/s - 90 dBm, - 92 dBm 2.44 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Microchip Technology RN4678APL-V/RM120
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth 5 Dual Mode with Shield, Antenna Module with ASCII Interface and MFI support FW 1.20
数据表
直接发货交货期 17 周
最低： 88
倍数： 88

BLE, Bluetooth 5.0, BR/EDR UART 1.5 dBm - 90 dBm, - 92 dBm 2.44 GHz Tray
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210CA Module Tape and Reel
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 SmartConnect WINC3400-MR210UA Module Tape and Reel
数据表

I2C, SPI, UART 18.3 dBm 1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s 2.4 GHz 2.7 V 3.6 V - 40 C + 85 C
Microchip Technology 蓝牙模块 - 802.15.1 Certified Dual Mode Bluetooth Module with ASCII Interface used with Apple MFI
数据表
Bluetooth v5.0, BR/EDR/LE Class 2 UART 1.5 dBm 1 Mb/s,kb/s,Mb/s - 90 dBm, - 92 dBm 2.48 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth 4.2 dual mode (BR/EDR/LE) module; ASCII, w/ shield, w/ antenna
数据表
Bluetooth v5.0, BR/EDR/LE Class 2 UART 1.5 dBm 1 Mb/s,kb/s,Mb/s - 90 dBm, - 92 dBm 2.48 GHz 3.3 V 4.2 V - 20 C + 70 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna
数据表

ADC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 5 dBm 2 Mb/s,kb/s,Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Microchip Technology 蓝牙模块 - 802.15.1 Bluetooth Low Energy/15.4 Combo Module with u.FL Antenna
数据表

ADC, GPIO, I2C, PWM, QSPI, RS485, SPI, USART 5 dBm 2 Mb/s,kb/s,Mb/s 2.4 GHz 1.9 V 3.6 V - 40 C + 85 C Tray
Silicon Labs 蓝牙模块 - 802.15.1 3241 LR AccPnt w/HDP Profile & IEEE Mnger

3241 Bluetooth 2.1 + EDR Class 1 Ethernet, USB 2.1 Mb/s,kb/s,Mb/s 2.4 GHz 9 V 24 V 0 C + 60 C
Silicon Labs 蓝牙模块 - 802.15.1 WT12 Class2 w/AntHDP Profile w/IEEE Agent
数据表

WT12 Bluetooth 2.1 + EDR Class 2 UART, USB 4 dBm 2.1 Mb/s,kb/s,Mb/s - 84 dBm 2.4 GHz 3.1 V 3.6 V - 40 C + 85 C
Silicon Labs 蓝牙模块 - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module
数据表

BGM260P Bluetooth v5.4 Class 2 ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 10 dBm 2 Mb/s,kb/s,Mb/s 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Reel
Silicon Labs 蓝牙模块 - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module
数据表

BGM260P Bluetooth v5.4 Class 2 ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 19.5 dBm 2 Mb/s,kb/s,Mb/s 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Reel, Cut Tape
Silicon Labs 蓝牙模块 - 802.15.1 Bluetooth Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
数据表

BGM270S 76.8 MHz - 40 C + 105 C Reel
Digi 蓝牙模块 - 802.15.1 XBee 3 BLU, 2.4 GHz, Bluetooth Low Energy, SMA, TH
数据表

STMicroelectronics STM32WBA5MMGH6
STMicroelectronics 蓝牙模块 - 802.15.1 Ultra-low-power, Arm Cortex-M33 TZ MCU 100 MHz with 1 Mbytes of Flash memory, Bluetooth LE 6.0, 802.15.4, Zigbee, Thread
数据表

STM32WBA Tray
Silicon Labs MGM240SA22VNA2R
Silicon Labs 蓝牙模块 - 802.15.1 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
数据表

xGM240S 2.4 GHz Reel
Silicon Labs MGM240SD22VNA2R
Silicon Labs 蓝牙模块 - 802.15.1 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm
数据表

xGM240S 2.4 GHz Reel
Silicon Labs PCB3241-eHealth-3.02
Silicon Labs 蓝牙模块 - 802.15.1 OEM 3241 LngRge w/HD P Profile & IEEE Mgr

3241 Bluetooth 2.1 + EDR Class 1 Ethernet, USB 2.4 GHz