2 Mb/s 多协议模块

结果: 117
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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
产品
封装
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
数据表

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi Multiprotocol Modules
Silicon Labs 多协议模块 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
数据表

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi Multiprotocol Modules
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
数据表

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Multiprotocol Modules Reel
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610GHN/A1ZDI
数据表

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Multiprotocol Modules Reel, Cut Tape
TEKTELIC 多协议模块 MODULE, INDUSTRIAL TRACKER, 2X D-CELL, LORA (Orca)
数据表
否
MODULE, INDUSTRIAL TRACKER, 2X D-CELL, LORA (Orca) 863 MHz to 870 MHz, 902 MHz to 928 MHz 22 dBm Ethernet - 40 C + 70 C 195 mm x 101 mm x 50 mm Bluetooth 5.0 BeiDou, GPS, Galileo, GLONASS GPS Asset Trackers
TEKTELIC 多协议模块 MODULE, INDUSTRIAL TRACKER, 2X D-CELL, LORA (Orca)
数据表
否
ORCA 863 MHz to 870 MHz 22 dBm Ethernet 3.6 V - 40 C + 70 C 195 mm x 101 mm x 50 mm Bluetooth 5.0 BeiDou, GPS, Galileo, GLONASS GPS Asset Trackers Bulk
TEKTELIC 多协议模块 MODULE, INDUSTRIAL TRACKER, 2X D-CELL, LORA (Orca)
数据表
否
ORCA 923 Hz to 928 Hz, 902 Hz to 915 Hz 22 dBm Ethernet 3.6 V - 40 C + 70 C 195 mm x 101 mm x 50 mm Bluetooth 5.0 BeiDou, GPS, Galileo, GLONASS GPS Asset Trackers Bulk
CEL 多协议模块 HOSTED DB Wi-Fi 6 + BT5.4 for IoT Connectivity (Bulk)
数据表

2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth WiFi Multiprotocol Modules
CEL 多协议模块 HOSTED DB Wi-Fi 6 + BT5.4 for IoT Connectivity (Tape & Reel)
数据表

2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth WiFi Multiprotocol Modules