2.4 GHz, 5 GHz 多协议模块

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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
产品
封装
u-blox 多协议模块
数据表
更多信息可用

MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表
更多信息可用

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表
更多信息可用

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表
更多信息可用

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
数据表
更多信息可用
2.4 GHz, 5 GHz 3.1 V 3.6 V' - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 Wi-Fi 6, IEEE 802.11a/b/g/n/ac/ax Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, ultra-compact LCC package, USB 2.0 interface only, antenna pin interface
数据表
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2.4 GHz, 5 GHz USB 3 V 3.6 V - 20 C + 70 C 13 mm x 12.2 mm x 2 mm Bluetooth 5.2 Wi-Fi 4, IEEE 802.11a/b/g/n Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, compact LCC package, USB 2.0 interface only, antenna pin interface
数据表
更多信息可用
2.4 GHz, 5 GHz USB 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm IEEE 802.11a/b/g/n/ac/ax Multiprotocol Modules Reel, Cut Tape
Quectel 多协议模块 NXP platform, SDIO Interface
数据表
更多信息可用
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
数据表
更多信息可用
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Modules Reel, Cut Tape
M5Stack 多协议模块 Compact ESP32-C5 wireless module offering dual-band Wi-Fi 6, Bluetooth 5, Zigbee, Thread, USB-C, battery support, and flexible embedded connectivity expansion.
数据表

2.4 GHz, 5 GHz USB 17.6 mm x 19.1 mm x 3.4 mm BLE WiFi Modules
M5Stack 多协议模块 Compact ESP32-C5 wireless module with DIP headers, dual-band Wi-Fi 6, Bluetooth 5, Zigbee, Thread, USB-C, battery support, and flexible peripheral expansion.
数据表

2.4 GHz, 5 GHz USB 17.6 mm x 19.1 mm x 3.4 mm BLE WiFi
Telit Cinterion 多协议模块

2.4 GHz, 5 GHz SPI, UART, USB - 40 C + 85 C WiFi 802.11 a/b/g/n Multiprotocol Module Tray
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4,Tape and Reel
数据表
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Reel
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4, Tape and Reel
数据表
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Reel
DFRobot 多协议模块 WiFi Module for LattePanda / NVIDIA Jetson Nano

2.4 GHz, 5 GHz NGFF IPEX 30 mm x 22 mm x 4.2 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2 Bulk
Panasonic Industry 多协议模块 PAN9028 mSDIO Adapter with module (NXP 88W8977)
数据表

PAN9028 mSDIO Dongle 2.4 GHz, 5 GHz 16 dBm UART 3.3 V 3.3 V - 30 C + 85 C Chip 24 mm x 12 mm x 2.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Seeed Studio 多协议模块 Realtek8720DN 2.4G/5G Dual Bands Wireless and BLE5.0 Combo Module
数据表
2.4 GHz, 5 GHz 7 dBm I2C, PWM, SPI, UART 3.3 V 3.3 V - 20 C + 85 C IPEX, PCB 24 mm x 16 mm x 3 mm Bluetooth 5.0 LTE 802.11 a/b/g/n
NXP Semiconductors 多协议模块 IW610BHN/A1ZDI
数据表

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel
NXP Semiconductors 多协议模块 IW610CHN/A1ZDI
数据表

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Multiprotocol Modules Reel
NXP Semiconductors 多协议模块 IW610FHN/A1ZDI
数据表

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多协议模块 IW610GHN/A1ZDI
数据表

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Multiprotocol Modules Reel, Cut Tape
Murata Electronics 多协议模块
数据表

2.4 GHz, 5 GHz 19 dBm UART 1.71 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi, 802.11a/b/g/n/ac/ax Multiprotocol Module Reel
Telit Cinterion 多协议模块 WE866C6-P Wi-Fi 11ac + BT/BLE-5 MODULE
数据表
2.4 GHz, 5 GHz UART - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth LTE 802.11 a/b/g/n/ac Bluetooth Modules Reel

Embedded Artists 多协议模块 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
数据表

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac WiFi Modules Bulk
Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas
数据表

2.4 GHz, 5 GHz 3 dBm, 19 dBm GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 3.3 V 3.3 V - 40 C + 85 C Chip 24.5 mm x 15.5 mm BLE 802.11 a/b/g/n/ac/ax 802.15.4 802.11 a/b/g/n/ac/ax, 802.15.4, BLE Reel