2.4 GHz, 5 GHz 多协议模块

结果: 313
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
ADLINK Technology WIFI BT M.2 WIRELESS-AC 9260 INDUS
ADLINK Technology 多协议模块 802.11a/b/g/n/ac, Wave 2, 2x2, Bluetooth 5, PCIe, USB, M.2 2230Operating Temperature -40-85Intel,9260.NGWGII.NV
2.4 GHz, 5 GHz M.2, PCIe, USB - 40 C + 85 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology EWK-M2-AC9260-ET
ADLINK Technology 多协议模块 INTEL AC9260 IND. WIFI w/ mPCIe converter
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology EWK-M2-AC9260-ET W MPCIE CONVERTER
ADLINK Technology 多协议模块 INTEL AC9260 IND. WIFI w/ mPCIe converter
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V - 40 C + 75 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology EWK-M2-AC9260 w/ mPCIe converter
ADLINK Technology 多协议模块 INTEL AC9260 Non-VPRO WIFI/BT KIT2x2 WiFi 802.11a/b/g/n/acBluetooth5.0M.2 2230 with PCIe/USB I/FOperating Temperature: 0-70C Driver for WIN10, Linux2pcs x IPEX MHF4 cables2pcs x Antenna
2.4 GHz, 5 GHz M.2, PCIe 3.135 V 3.465 V 0 C + 70 C IPEX MHF4, RP-SMA 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology INTEL AC9260 Non-VPRO WIFI/BT KIT
ADLINK Technology 多协议模块 INTEL AC9260 Non-VPRO WIFI/BT KIT2x2 WiFi 802.11a/b/g/n/acBluetooth5.0M.2 2230 with PCIe/USB I/FOperating Temperature: 0-80C Driver for WIN10, Linux2pcs x IPEX MHF4 cables2pcs x Antenna
2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 30 mm x 22 mm x 2.4 mm Bluetooth 5.1 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 5.1
ADLINK Technology M2-R8852BE W MPCIE CONVERTER
ADLINK Technology 多协议模块 R8852BE WIFI6BT w/ mPCIe converter
2.4 GHz, 5 GHz mPCIe 3.3 V 3.3 V - 10 C + 70 C MHF4 30 mm x 22 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ac 802.11 a/b/g/n/ac/ac, Bluetooth 5.2
ADLINK Technology MVP AC9620 WIFI BT KIT
ADLINK Technology 多协议模块 Intel Wireless-AC 9260, cables, and antennas for the MVP-5200 and MVP-6200
2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C Bluetooth 5.1 802.11 ac 802.11 ac, Bluetooth 5.1
CEL 多协议模块 HOSTED DB Wi-Fi 6 + BT5.4 for IoT Connectivity (Bulk)

2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth WiFi Multiprotocol Modules
CEL 多协议模块 HOSTED DB Wi-Fi 6 + BT5.4 for IoT Connectivity (Tape & Reel)

2.4 GHz, 5 GHz - 40 C + 85 C Bluetooth WiFi Multiprotocol Modules
CEL 多协议模块 Tri-mode (WiFi, BT, 802.15.4) Radio w/USB/USB/SPI interface, SMT with Antenna, (Bulk)

2.4 GHz, 5 GHz SPI, USB - 40 C + 85 C 27.8 mm x 16.64 mm x 3.47 mm Bluetooth WiFi Multiprotocol Modules
CEL 多协议模块 Tri-mode (WiFi, BT, 802.15.4) Radio w/USB/USB/SPI interface, SMT with Antenna, (Tape & Reel)

2.4 GHz, 5 GHz SPI, USB - 40 C + 85 C 27.8 mm x 16.64 mm x 3.47 mm Bluetooth WiFi Multiprotocol Modules
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.5 mm BLE 5.2 802.11 a/b/g/n 802.11 a/b/g/n, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.5 mm BLE 5.2 802.11 a/b/g/n 802.11 a/b/g/n, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.5 mm BLE 5.2 802.11 a/b/g/n 802.11 a/b/g/n, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.35 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.35 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -40C to +85C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 40 C + 85 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 286.8Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4.5 dBm, 19 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 286.8Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 1.9 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, Bluetooth 5.2, DBS, M.2 FF, Co-existence with Cellular
2.4 GHz, 5 GHz PCIe 3 V 3.6 V - 30 C + 65 C 22 mm x 30 mm x 4 mm Bluetooth 5.3 802.11a/b/g/n/ac/ax Modules Tray
Quectel 多协议模块 SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel
Quectel 多协议模块 SC200E with eMCP memory. Recommended to use discrete memory option for better pricing(EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, Galileo, GLONASS, GPS, LTE Cat 4, QZSS, SBAS Reel