2.4 GHz 多协议模块

结果: 349
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 资格 产品 封装
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Multiprotocol Wireless Module Reel
Telit Cinterion 多协议模块

2.4 GHz 8 dBm, 18 dBm SPI, UART - 40 C + 85 C 14.3 mm x 13.1 mm WiFi-802.11 b/g/n Tray
Inventek ISM43439-WBP-L151
Inventek 多协议模块

2.4 GHz 17 dBm I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C BLE, Bluetooth 5.2 802.11 b/g/n 802.11 b/g/n, BLE, Bluetooth 5.2 Reel
Quectel 多协议模块
2.4 GHz ADC, Audio, I2C, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C External 31 mm x 28 mm x 2.4 mm Bluetooth 4.2 BR/EDR LTE Cat 1 BeiDou, Galileo, GLONASS, GPS 802.11 b 802.11 b, BeiDou, Bluetooth 4.2 (BR/EDR), Galileo, GLONASS, GPS, LTE Cat 1
Quectel 多协议模块
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax 802.11 b/g/n/ax, BLE 5.2
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: Pin, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, extended temp -40-105C, 2MB flash
2.4 GHz - 40 C + 105 C BLE 5.2 Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-4, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-4 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-1, -40 85C, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-1 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, -40 85C, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 4MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C PCB 24 mm x 16 mm x 2.6 mm BLE 5.2 802.11 b/g/n 802.11 b/g/n, BLE 5.2 Reel
Quectel 多协议模块 Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax 802.11 b/g/n/ax, BLE 5.2 Reel
Quectel 多协议模块 Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: LCC, -40 85C, 8MB flash
2.4 GHz ADC, I2C, I2S, PWM, SPI, UART 3 V 3.6 V - 40 C + 85 C Pin Antenna Interface 25.5 mm x 18 mm x 3.2 mm BLE 5.1 802.11b/g/n/ax Modules Reel
Quectel 多协议模块 Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: IPEX-1, -40 85C, 8MB flash
2.4 GHz ADC, I2C, I2S, PWM, SPI, UART 3 V 3.6 V - 40 C + 85 C RF Coaxial Connector 25.5 mm x 18 mm x 3.2 mm 802.11b/g/n/ax Modules Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz,1x1 antenna,BLE 5.2, Antenna: Pin, -40 105C, 2MB flash
2.4 GHz GPIO, I2C, PWM, SPI, UART 3 V 3.6 V - 40 C + 105 C Pin Antenna Interface 12.5 mm x 13.2 mm x 1.8 mm BLE 5.2 WiFi 4, 802.11b/g/n Modules Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz,1x1 antenna,BLE 5.2, Antenna: RF coax conn, -40 105C, 2MB flash
2.4 GHz GPIO, I2C, PWM, SPI, UART 3 V 3.6 V - 40 C + 105 C RF Coaxial Connector 12.5 mm x 13.2 mm x 1.8 mm BLE 5.2 WiFi 4, 802.11b/g/n Modules Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz,1x1 antenna,BLE 5.2, Antenna: PCB, -40 105C, 2MB flash
2.4 GHz GPIO, I2C, PWM, SPI, UART 3 V 3.6 V - 40 C + 105 C PCB Antenna 16.6 mm x 13.2 mm x 1.8 mm BLE 5.2 WiFi 4, 802.11b/g/n Modules Reel
Quectel 多协议模块 Wi-Fi 4, 2.4 GHz, BLE5.2, 256 KB RAM, 2 MB flash, 1 1 antenna: LLC (pin), -40 105C, DIP package (FF)
2.4 GHz GPIO 3 V 3.6 V - 40 C + 105 C Pin Antenna Interface 12.7 mm x 8.5 mm x 2.55 mm BLE 5.2 802.11b/g/n Reel