Quectel 多协议模块

结果: 624
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Quectel 多协议模块
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS BDS, EGPRS, Galileo, GLONASS, GPS, LTE Cat M1/NB2
Quectel 多协议模块
ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS GNSS, LTE Cat 4
Quectel 多协议模块
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 44 mm x 43 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 3.1, Bluetooth 4.2, Bluetooth 5.0, LTE Cat 4 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 3.1, Bluetooth 4.2, Bluetooth 5.0, LTE Cat 4, Galileo, GLONASS, GPS, LTE Cat 4, QZSS
Quectel 多协议模块
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 44 mm x 43 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.1, Bluetooth 4.2, Bluetooth 5.0, LTE Cat 4 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, BDS, Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0, LTE Cat 4, Galileo, GLONASS, GPS, LTE Cat 4, QZSS
Quectel 多协议模块
23 dBm ADC, GPIO, I2C, USB 2.0 2.2 V 4.35 V - 35 C + 75 C 14.9 mm x 12.9 mm x 1.9 mm LTE Cat M1/NB2, NB-IoT GLONASS, GPS GLONASS, GPS, LTE Cat M1/NB2, NB-IoT
Quectel 多协议模块
2.2 V 4.5 V 17.7 mm x 15.8 mm x 2.2 mm LTE Cat NB2 BDS, Galileo, GLONASS, GPS BDS, Galileo, GLONASS, GPS, LTE Cat NB2
Quectel 多协议模块 CPU: 2 + 6 Kyro CPU, GPU: Adreno 613, Wi-Fi: 2 2 11ax DBS; Bluetooth 5.2, Modem: 5G Sub 6/ LTE Cat 16, GNSS: L1
Reel
Quectel 多协议模块 cloud enabled, Cat 1 + 2G, Cat1, 8M, w/ GNSS, w/ BT4.2, EMEA/ Australia/ New Zealand
Reel
Quectel 多协议模块
2.4 GHz ADC, Audio, I2C, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C External 31 mm x 28 mm x 2.4 mm Bluetooth 4.2 BR/EDR LTE Cat 1 BeiDou, Galileo, GLONASS, GPS 802.11 b 802.11 b, BeiDou, Bluetooth 4.2 (BR/EDR), Galileo, GLONASS, GPS, LTE Cat 1
Quectel 多协议模块
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax 802.11 a/b/g/n/ac/ax, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.5 mm BLE 5.2 802.11 a/b/g/n 802.11 a/b/g/n, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.5 mm BLE 5.2 802.11 a/b/g/n 802.11 a/b/g/n, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.5 mm BLE 5.2 802.11 a/b/g/n 802.11 a/b/g/n, BLE 5.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.35 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel 多协议模块
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.35 mm Bluetooth 4.2 802.11 a/b/g/n/ac 802.11 a/b/g/n/ac, Bluetooth 4.2
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -40C to +85C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 40 C + 85 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 286.8Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4.5 dBm, 19 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 286.8Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART, USB 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 1.9 mm Bluetooth Wi-Fi, IEEE 802.11 a/b/g/n/ac/ax Multiprotocol Module Reel
Quectel 多协议模块
2.4 GHz, 5 GHz, 6 GHz PCIe, PCM, UART 3 V 3.6 V - 20 C + 70 C 20 mm x 16 mm x 1.8 mm BLE 5.3 802.11 a/b/g/n/ac/ax/be 802.11 a/b/g/n/ac/ax/be, BLE 5.3
Quectel 多协议模块
2.4 GHz, 5 GHz, 6 GHz PCIe, PCM, UART 3 V 3.6 V - 20 C + 70 C 20 mm x 16 mm x 1.8 mm BLE 5.3 802.11 a/b/g/n/ac/ax/be 802.11 a/b/g/n/ac/ax/be, BLE 5.3
Quectel 多协议模块 Wi-Fi 7, triple-band support, BLE 5.3, module w/ filter
2.4 GHz, 5 GHz, 6 GHz PCIe, PCM, UART 3 V 3.6 V - 20 C + 70 C 20 mm x 16 mm x 1.8 mm BLE 5.3 802.11 a/b/g/n/ac/ax/be 802.11 a/b/g/n/ac/ax/be, BLE 5.3 Reel