xGM260P 无线模块

Silicon Labs xGM260P无线模块是2.4GHz频率设备,具有出色的射频性能。MGM260P模块基于EFR32MG26片上系统 (SoC),支持Bluetooth® 、Zigbee ®、Thread和Matter等协议。这些MGM260P模块采用Secure Vault®技术,支持各种高级调试和开发工具。BGM260P模块基于EFR32BG26 SoC,支持低功耗蓝牙 (BLE) 和蓝牙网状网络。这些xGM260P无线模块非常适合用于灯泡和需要额外PCB布局灵活性的设计。

结果: 6
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 177库存量
¥107.9489
¥94.3776
¥88.9197
¥82.2188
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape


Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 62库存量
¥108.5252
¥92.9764
¥92.0611
¥78.6593
最低: 1
倍数: 1
MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 58库存量
100预期 2026/10/30
¥108.4461
¥91.3153
¥80.3995
¥80.3204
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 131库存量
¥108.2766
¥94.0499
¥89.1683
¥82.3883
最低: 1
倍数: 1
MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 142库存量
¥117.0454
¥98.5925
¥95.4511
¥87.9253
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多协议模块 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 23库存量
¥109.9264
¥96.1178
¥90.5695
¥83.7104
最低: 1
倍数: 1
MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C PCB Trace 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape