+ 85 C 多协议模块

结果: 592
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数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
资格
封装
Kaga FEI 多协议模块 WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
数据表
更多信息可用

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI 多协议模块 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
数据表
更多信息可用

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 9.5 x 12.4 / 21 GPIO / -40-85 degC / external IPEX connection
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 12.4 mm x 9.6 mm x 2.4 mm BLE WiFi
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-85 degC / onboard PCB antenna
数据表
更多信息可用

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
Telit Cinterion 多协议模块
更多信息可用

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Quectel 多协议模块 2.4 GHz + 5 GHz + 6 GHz,Triple-band Wi-Fi 7, BT6.0 dual-mode
数据表
更多信息可用
2.4 GHz, 5 GHz, 6 GHz 3 V 3.6 V - 30 C + 85 C 15 mm × 13 mm × 1.8 mm Bluetooth WiFi Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
更多信息可用
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
数据表
更多信息可用
2.4 GHz, 5 GHz 3.1 V 3.6 V' - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 Wi-Fi 6 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
数据表
更多信息可用
2.4 GHz, 5 GHz UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth 5.4 WiFi 6 Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
数据表
更多信息可用
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel 多协议模块 NXP platform, SDIO Interface
数据表
更多信息可用
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
数据表
更多信息可用
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Ezurio 多协议模块 Module, Sona NX611, 1 x RF Trace, MIMO, SIP, Tape and Reel
数据表
Sona NX611 2.4 GHz to 2.495 GHz, 5.15 GHz to 5.825 GHz SDIO, UART - 40 C + 85 C Trace Pin Bluetooth 5.4, Bluetooth LE WiFi 6 Reel
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4,Tape and Reel
数据表
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Reel
Ezurio 多协议模块 Module, Sona MT320, MIMO, M.2 1420, MHF4, Tape and Reel
数据表
2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Reel
Ezurio 多协议模块 Module, Veda SL917, 4MB Flash, NCP, Trace Pad, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Reel
Ezurio 多协议模块 Module, Veda SL917, 8MB Flash, SoC, Trace Pad, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Reel
Ezurio 多协议模块 Module, Veda SL917, 4MB Flash, NCP, Integrated Antenna, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Reel
Ezurio 多协议模块 Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, Cut Tape
数据表
Veda SL917 2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C Chip 21.1 mm x 16 mm x 2.3 mm Bluetooth 5.4, Bluetooth LE WiFi 6, 802.11 b/g/n/ax Reel
Ezurio 多协议模块 Module, Vela IF310, Integrated Antenna, Tape and Reel
数据表
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Reel
Ezurio 多协议模块 Module, Vela IF310, MHF4, Tape and Reel
数据表
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Reel
Ezurio 多协议模块 Module, Vela IF310, Trace Pin, Tape and Reel
数据表
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Reel
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Tape and Reel
数据表
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Tape and Reel
数据表
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel